Multi-spectral imaging structure and method, chip, camera module and electronic equipment

A multi-spectral imaging and camera module technology, applied in the field of multi-spectral imaging structure, can solve the problems of long switching time and affecting the accuracy of spectral acquisition, etc., and achieve the effect of increasing frame rate, switching time and scanning rate

Active Publication Date: 2021-03-12
VIVO MOBILE COMM CO LTD
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Problems solved by technology

[0004] The purpose of the embodiment of the present application is to provide a multi-spectral imaging structure, method, chip, camera module and electronic equipment, which can solve the problem that the switching time of different bands is too long when MFPI performs spectral scanning of different bands in the prior art, which in turn leads to Only static objects can be photographed and the shaking during the photographing process will affect the accuracy of spectral collection

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  • Multi-spectral imaging structure and method, chip, camera module and electronic equipment
  • Multi-spectral imaging structure and method, chip, camera module and electronic equipment
  • Multi-spectral imaging structure and method, chip, camera module and electronic equipment

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[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0036] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," et...

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Abstract

The invention discloses a multispectral imaging structure and method, a chip, a camera module and electronic equipment, and belongs to the technical field of imaging. The multispectral imaging structure includes: a microlens; a photosensitive device which is arranged opposite to the micro lens and is used for converting the received optical signal into an electric signal; a first tunable optical filter and a second tunable optical filter which are located between the micro lens and the photosensitive device and used for transmitting n kinds of light by adjusting the cavity length of the resonant cavity; a first optical filter located between the first tunable optical filter and the photosensitive device; and a second optical filter located between the second tunable optical filter and thephotosensitive device. In the embodiment of the invention, by arranging the two tunable optical filters and the two optical filters, the switching time of spectrum scanning can be greatly improved, and the scanning rate of a photosensitive device is improved, so that the frame rate of image acquisition is improved.

Description

technical field [0001] The present application belongs to the field of imaging technology, and in particular relates to a multispectral imaging structure, method, chip, camera module and electronic equipment. Background technique [0002] With the development of electronic and optical technology, the photographing effect of terminal equipment such as mobile phones has been greatly improved, and the related components of mobile phone cameras have undergone rapid technological iterations in recent years, such as complementary metal oxide semiconductors with higher pixels and better imaging effects Image sensor (CMOS Image Sensor, CIS) imaging chips are being gradually launched; among them, multispectral technology has also been applied to imaging chips, which can achieve more accurate and more spectral band signal sensing than traditional RGBCIS chips; at the same time, spectral imaging chips can also Outputting spectral curves with spatial resolution makes it possible to impl...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14601H01L27/1461H01L27/14621H01L27/14625
Inventor 成通
Owner VIVO MOBILE COMM CO LTD
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