Labeling device of FOSB packaging assembly line

Abstract

The invention discloses a labeling device of an FOSB packaging assembly line. The labeling device comprises an integral rack, a feeding platform, a rotary lifting translation conveyor belt, a top clamping device, an ID label marking and stripping device, a warning label stripping device, an ID label pasting device, a warning label pasting device and a shooting device, wherein the feeding platformand the rotary lifting translation conveying belt are both fixed on the integral rack, the feeding platform is arranged at the inlet end of the rotary lifting translation conveying belt, the top clamping device is fixed above the feeding platform and the rotary lifting translation conveying belt, and the ID label marking and stripping device, the warning label stripping device, the warning label pasting device and the ID label pasting device are mounted on the side, the same as the rotary lifting translation conveying belt, of the integral rack. The labeling device can automatically complete labeling work of wafer packaging boxes, and has high degree of automation, less manpower consumption and high labeling efficiency.

Description

Technical field [0001] The present invention relates to the field of wafer packaging box, and more particularly, more particularly to a labeling device of a FOSB package pipeline. Background technique [0002] The wafer is a silicon chip made of a silicon semiconductor integrated circuit. Since its shape is circular, it is referred to as a wafer, and the wafer is a carrier for the production of integrated circuits, and the wafer in general refers to the wafer. It is a single crystal silicon wafer, and the single crystal returning is made of conventional silicon shades, which is dissolved, purified, distilled, and then supports the single crystal silicon rod, and the single crystal silicon rod is polished, and the wafer is formed after the slice. With the continuous development of the integrated circuit manufacturing technology, the size of the chip feature is getting smaller and smaller. The number of interconnect layers has increasing, the diameter of the wafer is increasing, to...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to solve the problem that the existing automatic labeling machine cannot meet the various needs of the labeling of the wafer packaging box, and proposes a labeling device for the FOSB packaging line, which can automatically complete the labeling of the wafer packaging box. High degree of automation, reduced manpower consumption, high labeling efficiency

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