Labeling device of FOSB packaging assembly line

A packaging line and labeling technology, which is applied in the field of labeling devices of FOSB packaging lines, can solve the problems of high labeling efficiency and inability to meet various needs of wafer packaging box labeling, etc.

Pending Publication Date: 2021-03-16
无锡迪渊特科技有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to solve the problem that the existing automatic labeling machine cannot meet the various needs of the labeling of the wafer packaging box, and proposes a

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Labeling device of FOSB packaging assembly line
  • Labeling device of FOSB packaging assembly line
  • Labeling device of FOSB packaging assembly line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0068] The present invention will be further described below with reference to the accompanying drawings:

[0069] Such as Figure 1 ~ 19 As shown, a labeling device of a FOSB packaging pipeline includes a fixing frame 1, a rotatable conveyor belt 3, an ID tag marking, alert strip device 6, an ID tag label device 7, alert label sticker The labeling device 8 and the label test shooting device 9 are provided with four roller 2 and four support legs 4 at the bottom of the fixed frame 1. When moving, four support legs 4 are colliled and passed through four roller wheels. 2 Push the movement of the fixing rack 1; After the movement is completed, the four support pin 4 is put down, and the four support legs 4 are supported by knob adjusting the height of the height.

[0070] The rotatable conveyor belt 3 capable of rotating the wafer package 10 is fixed to the fixing frame 1; ID tag marking destnerator 5, alert tag stripper device 6, alert label label device 8 and ID label label device 7...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a labeling device of an FOSB packaging assembly line. The labeling device comprises an integral rack, a feeding platform, a rotary lifting translation conveyor belt, a top clamping device, an ID label marking and stripping device, a warning label stripping device, an ID label pasting device, a warning label pasting device and a shooting device, wherein the feeding platformand the rotary lifting translation conveying belt are both fixed on the integral rack, the feeding platform is arranged at the inlet end of the rotary lifting translation conveying belt, the top clamping device is fixed above the feeding platform and the rotary lifting translation conveying belt, and the ID label marking and stripping device, the warning label stripping device, the warning label pasting device and the ID label pasting device are mounted on the side, the same as the rotary lifting translation conveying belt, of the integral rack. The labeling device can automatically complete labeling work of wafer packaging boxes, and has high degree of automation, less manpower consumption and high labeling efficiency.

Description

Technical field [0001] The present invention relates to the field of wafer packaging box, and more particularly, more particularly to a labeling device of a FOSB package pipeline. Background technique [0002] The wafer is a silicon chip made of a silicon semiconductor integrated circuit. Since its shape is circular, it is referred to as a wafer, and the wafer is a carrier for the production of integrated circuits, and the wafer in general refers to the wafer. It is a single crystal silicon wafer, and the single crystal returning is made of conventional silicon shades, which is dissolved, purified, distilled, and then supports the single crystal silicon rod, and the single crystal silicon rod is polished, and the wafer is formed after the slice. With the continuous development of the integrated circuit manufacturing technology, the size of the chip feature is getting smaller and smaller. The number of interconnect layers has increasing, the diameter of the wafer is increasing, to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B65C9/18B65C9/46B65C9/40B65C9/02B65B63/00B65B65/00
CPCB65B63/005B65B65/003B65C9/0006B65C9/02B65C9/1865B65C9/40B65C9/46B65C2009/404
Inventor 王迪杏计时鸣王宁
Owner 无锡迪渊特科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap