Light emitting diode epitaxial wafer and manufacturing method thereof
A technology of light-emitting diodes and manufacturing methods, which can be applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as effective carrier recombination, low internal quantum luminescence efficiency of light-emitting diodes, and poor carrier confinement capabilities
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[0028] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the implementation manners of the present disclosure will be further described in detail below in conjunction with the accompanying drawings.
[0029] figure 1 is a schematic structural view of a light-emitting diode epitaxial wafer provided by an embodiment of the present disclosure, as shown in figure 1 As shown, the LED epitaxial wafer includes a substrate 1 , and a buffer layer 2 , an undoped AlGaN layer 3 , an N-type layer 4 , an active layer 5 and a P-type layer 6 stacked on the substrate 1 in sequence.
[0030] The active layer 5 includes a plurality of quantum well layers 51 and quantum barrier layers 52 alternately grown periodically, and each quantum well layer 51 is A z Ga 1-z N layers. The multiple quantum barrier layers 52 include multiple first-type quantum barrier layers 521 close to the N-type layer 4 and multiple second-type quantum barrier layers 522 c...
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