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3D printing device and method for repairing faults of circuit board

A 3D printing and 3D printer technology, applied in the field of 3D printing, can solve the problems of high difficulty and low efficiency when repairing circuit boards

Pending Publication Date: 2021-03-19
LINYI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a 3D printing device and method for repairing circuit board faults, which can solve the problem of manual repair of circuit board defects and circuit boards with components through the organic combination of 3D printing technology and image recognition technology. Problems with high difficulty and low efficiency

Method used

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  • 3D printing device and method for repairing faults of circuit board
  • 3D printing device and method for repairing faults of circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0019] A kind of 3D printing device that is used to repair circuit board failure, comprises micro-jet 3D printer 2, and described micro-jet 3D printer 2 is installed with industrial camera 3, four-probe measuring instrument 6 above its workbench, industrial camera 3 and The micro-jet 3D printer 2 is electrically connected to the controller 4 through wires; the micro-jet 3D printer 2 is provided with an infrared laser 5 that moves with the printer nozzle on the working arm where the printer nozzle is installed; wherein the controller 4 Realize the control of the working path of the infrared laser 5 by controlling the working arm of the micro-jet 3D printer 2 while realizing the micro-jet 3D printer 2 injection path and the injection volume; the controller 4 is also used to receive pictures taken by the industrial camera 3 information and carry out the identification of the photographed content in order to detect the fault area; the industrial camera 3 is used to photograph the c...

Embodiment 2

[0021] A method for utilizing the 3D printing device described in embodiment 1 for repairing circuit board faults, wherein the method comprises the following steps: 1), the circuit board 1 marking the fault position is placed on the work of the micro-jet 3D printer 2 on the platform, and use the fixing device on the working platform to fix the circuit board 1, the controller 4 takes pictures of the circuit board 1 through the industrial camera 3, and uses image recognition technology to identify the fault location of the circuit board 1;

[0022] 2) Put the nano-conductive ink material required for repairing the circuit board 1 into the ink cartridge of the micro-jet 3D printer 2. After the nano-conductive ink material is atomized by the ultrasonic atomization generator, it is transported to the micro-jet 3D printer by the gas pipeline 2 print heads;

[0023] 3), carry out the planning of repairing circuit to the circuit fault in circuit board 1 by controller 4, and set proces...

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Abstract

The invention discloses a 3D printing device and method for repairing faults of a circuit board, and belongs to the field of 3D printing. The 3D printing device and method are used for repairing the circuit board. An industrial camera is mounted above a workbench of a micro-jet 3D printer, a controller is connected with the micro-jet 3D printer, the industrial camera and a four-probe measuring instrument, the four-probe measuring instrument is located above the workbench, and an infrared laser is arranged on a working arm, provided with a printer nozzle, of the micro-jet 3D printer. The controller is used for controlling a spraying path and a spraying amount of the micro-jet 3D printer, and controlling a working path of the infrared laser by controlling a working arm of the micro-jet 3D printer, the industrial camera is used for identifying the fault position of the circuit board, and the four-probe measuring instrument is used for measuring the conductivity of the circuit board. Through organic combination of a 3D printing technology and an image recognition technology, the problems of high difficulty and low efficiency during manual repairing of defective circuit boards and circuit boards with components are solved.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to a 3D printing device and method for repairing circuit board faults. Background technique [0002] Due to the manufacturing process and service conditions, in the process of manufacturing and actual use of the circuit board, it is inevitable that there will be defects such as: short circuit, convex copper, open circuit, etc. When the above defects appear on the circuit board, the traditional process needs to be manual The circuit board is selected and repaired. Since the wiring of the circuit board is relatively complicated and the adjacent distance is generally small, the manual repair is not only labor-intensive, but also requires the operator to have a high level of proficiency in operation. It will lead to the scrapping of circuit boards, etc., which will lead to high production costs. In addition, for circuit boards that have been welded with complete compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/135B29C64/245B29C64/314B29C64/386B29C64/393B29C64/30B33Y10/00B33Y30/00B33Y40/00B33Y40/10B33Y50/00B33Y50/02B33Y70/10H05K3/22
CPCB29C64/135B29C64/245B29C64/314B29C64/386B29C64/393B29C64/30B33Y10/00B33Y30/00B33Y40/00B33Y40/10B33Y50/00B33Y50/02B33Y70/10H05K3/225
Inventor 张远明庄娇娇张成雷亓琳王振乾王晓杰侯宗香
Owner LINYI UNIVERSITY
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