Double-sided cooling structure for power semiconductor module

Abstract

The invention discloses a double-sided cooling structure for a power semiconductor module. A heat dissipation bottom plate of a first radiator and a heat dissipation bottom plate of a second radiatorare arranged in parallel at an interval, and the power semiconductor module is arranged between the heat dissipation bottom plate of the first radiator and the heat dissipation bottom plate of the second radiator; a heat dissipation bottom plate of the first radiator abuts against the wall of the controller box body, the periphery of the heat dissipation bottom plate of the first radiator is connected with the controller box body, and a first cooling water channel is formed between the heat dissipation bottom plate of the first radiator and the wall of the controller box body; and an input port and an output port of the first cooling water channel are respectively connected with a cooling liquid output end and a cooling liquid input end in the controller box body. Through large-area contact with the controller box body, the heat capacity of the radiator is increased, temperature fluctuation of the power semiconductor chip is avoided while the controller box body is fully cooled, closecontact between the power module and the cooler is achieved, the contact gap is reduced, and the cooling effect is improved.

Description

technical field [0001] The invention relates to the technical field of power device cooling, in particular to a double-sided cooling structure for power semiconductor modules. Background technique [0002] The power semiconductor module is a whole that combines and packages power electronic components according to certain functions. It has the advantages of small size and high power density, so it has a wide range of applications in the field of new energy vehicles. With the development of new energy vehicles in terms of high power and long battery life, the application environment of power semiconductor modules is becoming increasingly harsh, and the reliability of power semiconductor modules has received widespread attention. [0003] Thermal reliability is an important part of the reliability of power semiconductor modules, and thermal reliability requires that power semiconductor modules have good heat dissipation performance. Generally, the heat transfer Q of the radia...

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Problems solved by technology

[0009] Chinese patent documents CN107408554A and CN102664177A respectively disclose a power semiconductor assembly, a power conversion device, and a double-sided cooling power semiconductor module, which use a cooling structure with a pressing function to eliminate and reduce the gap between the power module and the cooler , but this structure makes the structure of the cooler complicated, and at the same time, it cannot realize the function of relying on the controller box for heat dissipation and cooling, and cooling the controller box

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