Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Millimeter wave broadband packaging antenna based on Fan-out packaging process

A packaging process and millimeter wave technology, applied in the structural form of radiation elements, etc., can solve problems such as unrealized broadband characteristics, and achieve the effects of avoiding energy loss, small return loss, and increasing gain

Active Publication Date: 2021-03-19
ANHUI UNIVERSITY
View PDF15 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Although the above literature has proved that the antenna packaged with eWLB has good directivity, it has not yet achieved good broadband characteristics in terms of impedance matching bandwidth and most of the above antenna types are narrow-band resonant structures

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Millimeter wave broadband packaging antenna based on Fan-out packaging process
  • Millimeter wave broadband packaging antenna based on Fan-out packaging process
  • Millimeter wave broadband packaging antenna based on Fan-out packaging process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0059] Such as figure 1 , figure 2 As shown, a millimeter-wave broadband packaged antenna based on the Fan-out packaging process includes a rear protective layer 1, a glass molding material layer 2, a first passivation layer 3 and a second passivation layer 4. The package assembly, the microwave dielectric board 6 connected to the second passivation layer 4 through the ball grid array 5, the chip assembly and the redistribution layer (RDL) located in the glass molding material layer 2, and the rectangular ring 7 and the redistribution layer located in the redistribution layer antenna assembly. The chip assembly includes a silicon dioxide chip protection layer 8 and a silicon-based chip 9 located therein.

[0060] The antenna assembly is arranged inside the rectangular ring 7 and includes a circular patch antenna 10 , a feeding structure 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a millimeter wave broadband packaging antenna based on a Fan-out packaging process, and the antenna comprises a packaging assembly, a microwave dielectric plate connected with the packaging assembly through a ball grid array, a chip assembly and a rewiring layer which are located in the packaging assembly, and an antenna assembly located in the rewiring layer. The chip assembly comprises a silicon-based chip. The antenna assembly comprises a circular patch antenna and a feed structure, a single-side arc rectangular notch and a fan-shaped notch are engraved in the circular patch antenna, the center line of the single-side arc rectangular notch and the center line of the fan-shaped notch are located on the same straight line, one end of the feed structure is inserted into the single-side arc rectangular notch, and the other end is connected with a port of the silicon-based chip. By improving the circular patch antenna, the broadband characteristic is realized, andthe problem of the narrowband characteristic of the millimeter wave packaging antenna is solved.

Description

technical field [0001] The invention relates to the technical field of millimeter-wave packaged antennas, in particular to a millimeter-wave broadband packaged antenna based on a Fan-out packaging process. Background technique [0002] With the development of wafer level packaging (Wafer Level Packaging, WLP) technology, the use of WLP technology can effectively realize the embedding of heterogeneous devices, including baseband processors, radio frequency transceivers and power management ICs. According to different structures and manufacturing processes, WLP technologies can be roughly divided into two categories: fan-in WLP (Fan-in WLP) and fan-out WLP (Fan-out WLP). The characteristic of Fan-in WLP is that the pins are limited to the size outline of the chip. Due to the small chip area, in order to ensure the reliability of the bumps after flip-chip and facilitate the wiring design of the PCB, the size of the bumps must meet certain requirements. Therefore, in the Fan-in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01Q1/38
CPCH01Q1/38
Inventor 朱浩然鲁斌孙玉发吴先良
Owner ANHUI UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com