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A millimeter-wave broadband packaged antenna based on fan-out packaging technology

A packaging process, millimeter wave technology, applied in the direction of the radiating element structure, etc., can solve the problem of unrealized broadband characteristics, achieve the effect of length and width optimization, widen impedance bandwidth, and increase gain

Active Publication Date: 2022-04-15
ANHUI UNIVERSITY
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Although the above literature has proved that the antenna packaged with eWLB has good directivity, it has not yet achieved good broadband characteristics in terms of impedance matching bandwidth and most of the above antenna types are narrow-band resonant structures

Method used

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  • A millimeter-wave broadband packaged antenna based on fan-out packaging technology
  • A millimeter-wave broadband packaged antenna based on fan-out packaging technology
  • A millimeter-wave broadband packaged antenna based on fan-out packaging technology

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Embodiment Construction

[0058] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0059] like figure 1 , figure 2 As shown, a millimeter-wave broadband packaged antenna based on the Fan-out packaging process includes a rear protective layer 1, a glass molding material layer 2, a first passivation layer 3 and a second passivation layer 4. The package assembly, the microwave dielectric board 6 connected to the second passivation layer 4 through the ball grid array 5, the chip assembly and the redistribution layer (RDL) located in the glass molding material layer 2, and the rectangular ring 7 and the redistribution layer located in the redistribution layer antenna assembly. The chip assembly includes a silicon dioxide chip protection layer 8 and a silicon-based chip 9 located therein.

[0060] The antenna assembly is arranged inside the rectangular ring 7 and includes a circular patch antenna 10 , a feeding structure 11 a...

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Abstract

The present invention provides a millimeter-wave broadband package antenna based on a Fan-out packaging process, comprising a package component, a microwave dielectric board connected to the package component through a ball grid array, a chip component and a redistribution layer located in the package component, and a redistribution layer located in the package component. The antenna assembly in the layer, the chip assembly includes a silicon-based chip, the antenna assembly includes a circular patch antenna and a feeding structure, and the circular patch antenna is engraved with a unilateral arc rectangular gap and a fan-shaped gap, The centerline of the unilateral arc rectangular notch and the fan-shaped notch are in a straight line, one end of the feeding structure is inserted into the unilateral arc rectangular notch, and the other end is connected to the port of the silicon-based chip. The invention realizes the broadband characteristic by improving the circular patch antenna, and solves the problem of the narrow-band characteristic of the millimeter-wave packaged antenna.

Description

technical field [0001] The invention relates to the technical field of millimeter-wave packaged antennas, in particular to a millimeter-wave broadband packaged antenna based on a Fan-out packaging process. Background technique [0002] With the development of wafer level packaging (Wafer Level Packaging, WLP) technology, the use of WLP technology can effectively realize the embedding of heterogeneous devices, including baseband processors, radio frequency transceivers and power management ICs. According to different structures and manufacturing processes, WLP technologies can be roughly divided into two categories: fan-in WLP (Fan-in WLP) and fan-out WLP (Fan-out WLP). The characteristic of Fan-in WLP is that the pins are limited to the size outline of the chip. Due to the small chip area, in order to ensure the reliability of the bumps after flip-chip and facilitate the wiring design of the PCB, the size of the bumps must meet certain requirements. Therefore, in the Fan-in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38
CPCH01Q1/38
Inventor 朱浩然鲁斌孙玉发吴先良
Owner ANHUI UNIVERSITY
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