A Broadband Butterfly Patch Antenna Array Suitable for Millimeter Wave 5G Communications
A patch antenna and millimeter-wave technology, which is applied to the structural form of antenna arrays, antennas, and radiation elements, can solve problems such as the inability to meet the broadband requirements of 5G millimeter-wave communication systems, and achieve simple structure, wide impedance bandwidth, and wide radiation The effect of bandwidth
Active Publication Date: 2022-02-15
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
The structure of the antenna is very compact and the profile is low, but the impedance bandwidth of the antenna only covers the 39.8GHz-43.5GHz frequency range of about 8%, which cannot meet the broadband requirements of the 5G millimeter wave communication system
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[0035] Such as Figure 1-Figure 4 As shown, the broadband butterfly patch antenna array provided in this embodiment includes 8 butterfly radiating elements, and the 8 butterfly radiating elements are arranged along the x-axis and y-axis directions, which is called a broadband 8-element butterfly patch antenna array . Of course, in other embodiments, different numbers of butterfly radiation units may be set as appropriate.
[0036] Wherein, each butterfly radiation unit includes a first dielectric substrate 1, a second dielectric substrate 2, a third dielectric substrate 3, a metal floor 4, a microstrip feeder 5, two radiation patches 7, and two inductive metal vias 8 and a metal connecting strip wire with rounded ends 9. In this embodiment, the radiation patch 7 is set in a gradual shape, such as a rhombus. In other embodiments, the radiation patch can also be set in a non-gradient shape, such as a square or a rectangle. Both tapered and non-tapered shapes can achieve broa...
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The invention discloses a broadband butterfly patch antenna array suitable for millimeter wave 5G communication, which includes several butterfly radiation units arranged in an array, each butterfly radiation unit includes a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a metal floor with a gap, a microstrip feeder and a butterfly radiator, the metal floor is located on the upper surface of the first dielectric substrate, the microstrip feeder is located on the lower surface of the first dielectric substrate, and the butterfly radiator includes two A vertical inductive metal via hole opened on the third dielectric substrate, a metal connection strip line with a round end between the second dielectric substrate and the third dielectric substrate, and two radiation patches, two radiation patches It is oppositely arranged on the upper surface of the third dielectric substrate and is respectively connected to the metal connection strip line through two inductive metal via holes; the microstrip feeder line in each butterfly radiation unit is connected through a T-shaped power distribution junction to form a microstrip feeder network. The antenna array can be used in a 5G millimeter wave communication system.
Description
technical field [0001] The invention belongs to the field of wireless communication, and in particular relates to a broadband butterfly patch antenna array suitable for millimeter wave 5G communication. Background technique [0002] Due to the increasing shortage of spectrum resources in the low frequency band, the development of radio frequency devices in the millimeter wave band has attracted increasing attention from academia and industry. Millimeter waves have the characteristics of wide impedance bandwidth and strong anti-interference ability, but the loss of millimeter waves in free space is also much greater than that of electromagnetic waves in lower frequency bands. Therefore, the most basic requirement of millimeter-wave antenna is high gain, so as to compensate its loss in free space. The application of millimeter wave technology in future 5G communication systems has reached a broad consensus around the world. Countries have divided their own millimeter wave 5G ...
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IPC IPC(8): H01Q21/00H01Q1/36H01Q1/38
CPCH01Q21/00H01Q1/38H01Q1/36
Inventor 涂治红甘正
Owner SOUTH CHINA UNIV OF TECH