A kind of water-soluble lead-free solder paste, water-washing solder paste and preparation method thereof

Abstract

The invention discloses a water-washable superfine tin powder water-soluble lead-free high-temperature soldering paste and a preparation method thereof, comprising the following raw materials in parts by weight: 30-55 parts of antioxidant, 10-26 parts of organic solvent, and 4-4 thixotropic agent 8 parts, 8-16 parts of active agent, 6-10 parts of corrosion inhibitor and 6-10 parts of surfactant. The water-washed solder paste prepared by using the solder flux paste of the invention has good stability and effectively meets practical requirements such as oxidation resistance, fullness of tin dots, low voids, no residue splashing, and good cleaning performance.

Description

technical field

[0001] The invention belongs to the technical field of flux paste, and in particular relates to a water-soluble lead-free high-temperature flux paste of water-washed ultrafine tin powder and a preparation method thereof. Background technique

[0002] With the development of the semiconductor packaging industry, the semiconductor packaging methods have become more sophisticated, and the use of no-clean solder paste welding cannot meet the requirements of more and more precise and smaller pitch welding. Residues in the no-clean solder paste for ultra-fine pitch welding, especially chip welding of semiconductor device packaging, can easily cause chip breakdown and short circuit, drop in withstand voltage, leakage and many other adverse effects under the condition of large instantaneous current. . This requires that the residue must be completely removed after soldering, so the current ordinary rosin type no-clean solder paste cannot meet the cleaning requiremen...

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