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Pre-vacuum lock module, wafer transfer-in method and wafer transfer-out method

A pre-vacuum lock and wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of large space required for wafer processing equipment, limited flexibility of wafer picking, and limited transfer efficiency. problems, to achieve the effect of optimizing the wafer transfer process, improving the efficiency of wafer transfer, and facilitating handling and installation

Pending Publication Date: 2021-04-02
上海谙邦半导体设备有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to solve the existing wafer position detection module existing limited wafer picking flexibility, lead to complex transfer process and limit the improvement of transfer efficiency, and the problem that the wafer processing equipment requires a large space due to module separation, the object of the present invention To provide a new type of pre-vacuum lock module, wafer incoming method and outgoing method, which not only enables the pre-vacuum lock module to be integrated with the function of determining the center position and notch position of the wafer, but also helps reduce the number of wafer processing equipment. Smaller size (because there is no need to configure the wafer position detection module and positioner module), it is convenient for the handling and installation of the equipment, and there is no need to require the wafer pick-up arm to adopt a straight line and fixed-speed wafer transfer method, and there is no need to increase the movement points, so the wafer transfer process can be optimized and the efficiency of wafer transfer can be improved

Method used

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  • Pre-vacuum lock module, wafer transfer-in method and wafer transfer-out method
  • Pre-vacuum lock module, wafer transfer-in method and wafer transfer-out method
  • Pre-vacuum lock module, wafer transfer-in method and wafer transfer-out method

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Effect test

Embodiment 1

[0084] Such as Figure 1~2As shown, the pre-vacuum lock module provided in this embodiment includes a closed chamber 1 and a door panel, wherein the door panel is used to open the closed chamber 1 for the external wafer picking arm to enter and exit the chamber Inside, it also includes a lifting and rotating table 3, a laser transmitter 41, a laser receiver 42, a wafer left edge carrier plate 51 and a wafer right edge carrier plate 52; the lifting and rotating table 3 is arranged in the closed chamber 1 The center position of the bottom of the cavity, and can vertically lift and drive the wafer 100 to rotate on the horizontal plane after receiving the wafer 100; the laser emitter 41 and the laser receiver 42 are in the closed chamber The cavity is aligned up and down, and the radial distance from the position center of the laser emitter 41 and the laser receiver 42 to the rotation axis of the lifting turntable 3 is equal to the radius of the wafer 100 The wafer left edge carr...

Embodiment 2

[0101] On the basis of the technical solution of the first embodiment, this embodiment also provides a method for implementing wafer transfer by using the pre-vacuum lock module described in the first embodiment, including but not limited to the following steps S101-S112.

[0102]S101. Fill air into the cavity of the closed chamber 1 until the cavity is in a normal pressure environment.

[0103] In the step S101, specifically, the air can be filled into the cavity by conducting the inflation channel 7 .

[0104] S102. Open the door panel.

[0105] In the step S102, the door panel specifically refers to the first door panel for the first wafer pick-up arm under normal pressure environment to enter and exit the cavity after being opened.

[0106] S103. Extending into the cavity of the closed chamber 1 the first wafer picking arm under the normal pressure environment, so that after the wafer 100 is taken out from the wafer carrier, the wafer 100 is placed on the The wafer left ...

Embodiment 3

[0128] On the basis of the technical solution of the first embodiment, this embodiment also provides a method for implementing the transfer of wafers using the pre-vacuum lock module described in the first embodiment, which includes but is not limited to the following steps S201-S212.

[0129] S201. Evacuate the inside of the closed chamber 1 until the inside of the cavity is in a vacuum environment.

[0130] In the step S201, specifically, the air in the cavity can be sucked out by conducting the pumping channel 6 .

[0131] S202. Open the door panel.

[0132] In the step S202, the door panel specifically refers to a second door panel for the second wafer pick-up arm in a vacuum environment to enter and exit the cavity after being opened.

[0133] S203. Extend the second wafer picking arm under the vacuum environment into the cavity of the closed chamber 1, so that after the wafer 100 is taken out from the wafer processing chamber, place the wafer 100 on the The wafer left ...

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Abstract

The invention relates to the technical field of wafer processing and discloses a pre-vacuum lock module, a wafer input method and a wafer output method. A lifting rotary table is arranged at the center of the bottom in a cavity, and a laser transmitter and a laser receiver are arranged in the cavity in an up-and-down alignment mode; the radial distance between the position center of the laser emitter and the position center of the laser receiver and the rotating axis of the lifting rotating table is equal to the radius of a wafer, and in the rotating process, according to the rotating angle ofthe lifting rotating table and the receiving intensity of laser beams collected by the laser receiver, the laser beams can be sent to the laser receiver; the pre-vacuum lock module integrates the function of determining the circle center position and the notch position of the wafer, the size of wafer processing equipment can be reduced, a wafer taking arm does not need to adopt a linear wafer conveying mode with a fixed speed, and wafer taking efficiency is improved; moving points do not need to be added, so the wafer conveying process can be optimized, and wafer conveying efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of wafer processing, and in particular relates to a pre-vacuum lock module, a wafer input method and a wafer output method. Background technique [0002] In the process of wafer processing, it is not only necessary to transfer the wafer from the wafer carrier into the wafer processing chamber (such as the wafer etching chamber) before processing, but also to transfer the wafer from the wafer after processing. out of the processing chamber to the wafer carrier. At present, in wafer processing equipment, it is necessary to configure a pre-vacuum lock module (Loadlock Module, LLM) as a transition module for transferring wafers between the atmospheric pressure environment and the vacuum environment. The pre-vacuum lock module needs to avoid designing a large volume. In order to reduce the transfer time required for switching between normal pressure environment and vacuum environment, the specific transition pro...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67265H01L21/67742H01L21/67766
Inventor 邱勇孙晓东
Owner 上海谙邦半导体设备有限公司