Production method of novel non-filling hollow embedded inductor
A production method and non-filling technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as poor solder joints, filling voids, and low work efficiency, and achieve low glue flow characteristics, stable electromagnetic characteristics, and meet the transmission requirements. The effect of loss
Pending Publication Date: 2021-04-06
信丰迅捷兴电路科技有限公司 +1
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Problems solved by technology
The inductance element in the power supply part occupies more than 40% of the surface area of the power board, which is not conducive to the miniaturization and high density of product design. Most of the inductance in the power supply part needs to be manually mounted, which leads to low work efficiency and risks such as poor solder joints.
[0003] In addition, when the industry traditionally manufactures PCBs with embedded capacitors, resistors and inductors, it is made by resin filling method. Because the resin filling effect is affected by the amount of resin and pressing parameters (pressure, temperature), the embedded parts will crack due to pressure and force. Fill voids, bubbles and other functional issues
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[0024]The technical solutions in the embodiments of the present invention will be apparent from the drawings in the embodiment of the present invention.
[0025]Such asfigure 1As shown, one embodiment of the present invention discloses a novel non-filled hollow inductive inductance, including the following processing processes:
[0026]Mechanical depth: Processing the blind groove by the 锣 控 machine on the PCB board, while controlling the depth and diameter of the blind groove;
[0027]The deep blind groove is a critical control point. It is used for a large number of dedicated control demonstration machine production. It is mentioned in the previous technical issues that all depths are within the tolerance range. After embedding the magnetic core in the blind groove, confirm that its effect determines that the magnetic core is lower than the substrate surface. The whole new 锣 刀 is used to control, and the sword life crashed down half; the slot mode is carried out in a sink method to ensure ...
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The invention discloses a production method of a novel non-filling hollow embedded inductor, and relates to the technical field of circuit board production. The method comprises the following processing processes of: mechanical depth control: processing a blind slot on a PCB (Printed Circuit Board) through a milling cutter on a depth control milling machine, and simultaneously controlling the depth and the diameter of the blind slot; embedding a magnetic core: embedding the magnetic core into the blind slot; conducting pressing: conducting pressing by using No Flow PP single sheets, conducting setting by using yin-yang alignment, adopting a laminated structure of 'steel plates, aluminum sheets and steel plates', not adding a buffer pad, and windowing prepregs in advance; and conducting shape control: controlling the shape of the PCB by changing the feeding direction of the milling cutter and the sequence of a milling plate. According to the invention, the magnetic core is embedded into the PCB, and the through holes and the wires of the inner diameter and the outer diameter of the magnetic core are used as annular coils to form a non-filled hollow-out inductor device, so that a traditional inductor device with a packaged and welded surface is replaced.
Description
Technical field[0001]The present invention relates to the field of circuit board production, and in particular, a new type of non-filled hollow inductance is involved.Background technique[0002]Today, the inductance is a large number of applications in the design, the resulting passive filter circuit mainly hosts the signal and filtering. The inductance of the power supply type circuit board is generally surrounded by a very thick lineage line of the wire diameter being coated with a circular magnetic core coated with various colors. The inductive component of the power supply takes up more than 40% of the surface of the power board, which is not conducive to product design miniaturization, high-teching, and power supply partial inductance need to be handmade, low work efficiency, and there is a risk of adverse soldering sites.[0003]In addition, when the industry is used to produce the internal buried capacitor resistance inductance PCB, the resin filling method is used to produce, a...
Claims
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IPC IPC(8): H05K3/30
CPCH05K3/30
Inventor 陈强马卓杜林峰吉勇林清贊李舒平陈定成
Owner 信丰迅捷兴电路科技有限公司