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PC heat-insulation integrated board and production method

A production method and insulation board technology, applied in insulation, building components, ceramic molding machines, etc., can solve the problems of easy formation of condensation, self-heavy weight, increase in the difficulty and cost of component production and transportation, etc.

Inactive Publication Date: 2021-04-09
SHANGHAI VANKE REAL ESTATE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many problems in this method: there are discontinuous thermal insulation and cold bridge problems, which affect the external thermal insulation effect, and when there is a temperature difference in the corresponding room, it is easy to form condensation, which leads to mildew on the wall; the added outer panels not only Increasing the thickness of a single component also increases the self-weight of a single component; due to the increase in self-weight, it not only affects the flexibility of component disassembly, but also increases the difficulty and cost of production and transportation of components; in addition, the increase in self-weight of a single component, It also affects the site for on-site stacking, hoisting equipment, and management requirements
[0007] At present, no effective solutions have been proposed for the problems in the related technologies that the integrated insulation board cannot be prefabricated, on-site construction is required, the thickness of the insulation integrated board is thick and its weight is large, and the insulation is discontinuous.

Method used

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  • PC heat-insulation integrated board and production method
  • PC heat-insulation integrated board and production method
  • PC heat-insulation integrated board and production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] The invention provides a method for producing a PC thermal insulation integrated board, comprising the following steps:

[0059] Step S202, installing an anchoring element at a preset position of the insulation board, and making the anchoring element not protrude from the outer end surface of the insulation board;

[0060] Step S204, install the inner blade side mold on the inner end surface of the insulation board, so that the space between the inner blade side mold and the insulation board forms a pouring space, and make at least one edge of the insulation board of the insulation board and the inner blade side mold The distance between the mold edges on the side of the inner blade corresponding to the edge of the insulation board is 0-600mm;

[0061] Step S206, installing several steel bars inside the mold on the side of the inner blade;

[0062] Step S208, pouring concrete into the pouring space, and filling the pouring space with concrete;

[0063] Step S210, afte...

Embodiment 2

[0110] Such as Figure 4~5 As shown, the present invention provides a PC thermal insulation integrated board, which includes a thermal insulation board 1 , several anchoring elements 2 , several steel bars 4 and wall panels 5 .

[0111] The insulation board 1 is a rectangular structure, and its parameters are: the dry density of the insulation board is 160-220kg / m 3 , compressive strength ≥ 0.30mPa, vertical and board tensile strength ≥ 0.25MPa, compressive modulus of elasticity ≥ 20000kPa, bending load ≥ 3000N, bending deformation ≥ 6mm, volume water absorption ≤ 6%, thermal conductivity less than or equal to 0.054W / m·K, softening coefficient ≥ 0.8, drying shrinkage rate ≤ 0.3%, and the combustion performance level is at least A level.

[0112] In some of the embodiments, the impact resistance of the thermal insulation board is more than or equal to 10 times.

[0113] In some of the embodiments, in order to improve the strength of the insulation board 1 , the insulation bo...

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Abstract

The invention relates to a PC heat-insulation integrated board and a production method thereof. The PC heat-insulation integrated board comprises a heat-insulation board, a plurality of anchoring elements, a wall board and a plurality of reinforcing steel bars, wherein the dry density of the heat-insulation board is 160-220 kg / m<3>, and the compressive strength of the heat-insulation board is greater than or equal to 0.30 MPa; the anchoring elements are mounted on the heat-insulation board in a penetrating manner; the wall board is fixedly arranged on the inner end surface of the heat-insulation board, and the distance between at least one edge of the heat-insulation board and the edge, corresponding to the edge of the heat-insulation board, of the wall board is 0-600 mm; and the reinforcing steel bars are fixedly arranged in the wall board. The PC heat-insulation integrated board has the advantages that the heat-insulation board and the wall board are integrally prefabricated, so that the working procedures of erecting a template and pasting the heat-insulation board on a construction site are reduced; the edge of the heat-insulation board protrudes out of the edge of the wall board, so that the external heat insulation is continuous, and a cold bridge problem is avoided; and the problem that the heat-insulation board falls off is avoided within a relatively long time after project completion.

Description

technical field [0001] The invention relates to the technical field of building prefabricated panels, in particular to a PC thermal insulation integrated panel and a production method. Background technique [0002] Precast concrete (PC) is usually used to prepare concrete building components, such as exterior wall panels, floor slabs, stairs, etc. The design and implementation process of PC exterior wall panel components are taken as an example to illustrate. The existing PC exterior wall panel member is a structural groove with a lower part that overlaps the upper and lower plates, and the outer side is protruding and the inner side is concave. Structural reinforcement is reserved, that is, a cast-in-place section needs to be set up between the upper PC exterior wall panel component and the lower PC exterior wall panel component through on-site formwork, so that the upper PC exterior wall panel component and the lower PC exterior wall panel component Component connection....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/14B28B23/02E04B1/80E04B2/86
CPCB28B23/02B28B1/14E04B1/80E04B2/86
Inventor 宣刚蔡立彬孙自萍戴少卿黄海生孙栋杰余智谢奕李利江刘丙强
Owner SHANGHAI VANKE REAL ESTATE CO LTD