Illumination condition automatic correction method and device, equipment and storage medium
A technology for lighting conditions and automatic correction, which can be used in photolithographic process exposure devices, optomechanical equipment, microlithography exposure equipment, etc., and can solve problems such as low production efficiency
Pending Publication Date: 2021-04-09
CHANGXIN MEMORY TECH INC
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[0004] Based on this, it is necessary to provide a method, device, device and storage medium for automatic correction of lighting conditions in view of the problem that the process of correcting and confirming the uniformity of each exposure gap of the wafer in the traditional technology will lead to low production efficiency
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[0041] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. A preferred embodiment of the application is shown in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.
[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associa...
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The invention relates to an illumination condition automatic correction method, device and equipment and a storage medium. The illumination condition automatic correction method comprises the following steps: detecting a correction record file stored on a server of an exposure machine; and if the correction record file corresponding to the to-be-executed lighting condition setting is missing, performing corresponding lighting condition correction according to the type of the missing correction record file, and storing a result file obtained by lighting condition correction as the missing correction record file, thereby realizing automatic correction and confirmation of each lighting condition setting. Therefore, the frequency of equipment engineers entering a dust-free room can be reduced, time loss caused by machine borrowing, manual operation and the like is reduced, and the production efficiency is improved; and meanwhile, the stored lighting conditions are set to correspond to the correction record file, so that a process engineer can conveniently confirm whether the lighting conditions of the related wafer layers meet the requirements or not so as to execute the subsequent manufacturing process.
Description
technical field [0001] The present application relates to the technical field of semiconductor exposure, in particular to a method, device, equipment and storage medium for automatic correction of lighting conditions. Background technique [0002] In the wafer exposure process, when a new illumination setting (illumination setting) is applied to a certain layer, due to process requirements, the exposure slit uniformity (slit uniformity) of the illumination setting needs to meet certain standards. Therefore, it is necessary to perform fine optimization on the lighting condition setting, and confirm whether the uniformity of the exposure gap and the shape of the lighting condition meet the standards. [0003] During the implementation process, the inventors found that there are at least the following problems in the traditional technology: the exposure process of the wafer involves multiple layers, which are associated with multiple lighting condition settings; Exposure gap u...
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IPC IPC(8): G03F7/20G06F16/11G06F16/16
CPCG03F7/7055G03F7/70516G06F16/113G06F16/162
Inventor 胡立元
Owner CHANGXIN MEMORY TECH INC