Water film spreading device of solar cell wet etching machine

Abstract

The invention discloses a water film spreading device of a solar cell wet etching machine, the device comprises an etching machine body, through grooves are formed in the left side and the right side of the etching machine body, a plurality of transmission rollers are arranged in the etching machine body at equal intervals, silicon wafers are placed on the transmission rollers, a water outlet pipe is fixedly connected to the side wall of the etching machine body, the outer side of the water outlet pipe is sleeved with a second water conveying hose, a sixth hoop is fixedly installed on the outer side of the joint of the second water conveying hose and the water outlet pipe, and a machine cover is clamped to the upper end of the etching machine body. By designing a first motor, a driving bevel gear, a driven bevel gear, a connecting sleeve, a vertical pipe, a water pump, a first water conveying hose, the second water conveying hose and other components, a formed water spraying device can achieve rotary water spraying, spraying is more sufficient, water circulation can be achieved, waste of liquid medicine is avoided, and the liquid medicine is saved while rapid spraying is achieved.

Description

technical field [0001] The invention belongs to the technical field of solar cell production and manufacturing, and specifically relates to a water film spreading device of a solar cell sheet wet etching machine. Background technique [0002] At present, the wet etching machine adopts the method of spraying a water film to protect the surface of the "N" type silicon wafer, and the liquid is carried by the roller to remove the "N" type silicon layer on the back and edge of the solar cell. However, in the process of water film diffusion, the surface state of different types of silicon wafers is very different, resulting in differences in the diffusion effect of the water film; if the water film cannot completely cover the surface of the "N" type silicon wafer, the acid liquid and acid Fog will corrode the surface of the "N" type silicon wafer that is not protected by the water film, resulting in over-cutting and black edges, which will lead to a decrease in the efficiency of s...

AI Technical Summary

Problems solved by technology

However, with this design, it is difficult to ensure that all the water is sprayed on the silicon wafer. The spraying effect is not good enough, and there is no water cycle design, which leads to the water not being reused. Moreover, there is no dust filtering measure when spraying air, resulting in the dust being mixed with the water film. Contact causes pollution, and the effect of jetting needs to be further improved

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