Power device and substrate thereof

A technology for power devices and substrates, applied in the field of power devices and their substrates, can solve problems such as increased safety hazards and decreased insulation reliability.

Pending Publication Date: 2021-04-09
GREE ELECTRIC APPLIANCES INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] (1) The technical problem to be solved by the present invention is: as DBC develops tow

Method used

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  • Power device and substrate thereof
  • Power device and substrate thereof
  • Power device and substrate thereof

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Embodiment Construction

[0026] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0027] like Figure 1-Figure 5 As shown, the present invention provides a substrate, which includes an insulating part 1, a heat conduction part 2, a first conductive part 3 and a second conductive part 4, wherein, in order to ensure that the entire substrate has high thermal conductivity and heat dissipation performance, the present invention In the provided substrate, the insulation part 1 is provided with a heat conduction part 2 on one of the opposite sides along its thickness direction, so that the heat of the entire substrate is guided by the heat conducti...

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Abstract

The invention relates to the technical field of electronic appliances, in particular to a power device and a substrate thereof. The substrate comprises an insulating part, a heat conduction part, a first conductive part and a second conductive part, one of two opposite sides of the insulating part in the thickness direction is connected with the heat conduction part, the other side of the insulating part is connected with the first conductive part and the second conductive part, and an insulating interval is formed between the first conductive part and the second conductive part; a sinking groove is formed in the portion, located at the insulation interval, of the insulating part and extends from the surface of the insulating part to the direction where the heat conduction part is located. Even if the size of the substrate provided by the invention is relatively small, the insulation reliability of the substrate is relatively high, and the potential safety hazard is relatively small.

Description

technical field [0001] The invention relates to the technical field of electronic appliances, in particular to a power device and a substrate thereof. Background technique [0002] DBC (Direct Bonding Copper, copper-clad ceramic substrate) is widely used for its high thermal conductivity, high electrical insulation, high mechanical strength, low expansion and other characteristics of ceramics, as well as high conductivity and excellent welding performance of oxygen-free copper. use. With the ever-changing market demand, DBC gradually tends to be miniaturized, which makes the distance between electrodes relatively small, which may cause the insulation reliability of DBC to decrease and the potential safety hazard to increase. Contents of the invention [0003] (1) The technical problem to be solved by the present invention is: as DBC develops toward miniaturization, its insulation reliability decreases and potential safety hazards increase. [0004] (2) Technical solution...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/367H01L23/13
CPCH01L23/13H01L23/367H01L23/49838H01L23/49844H01L23/49894
Inventor 江伟史波敖利波王华辉陈治中
Owner GREE ELECTRIC APPLIANCES INC
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