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Laser

A technology of lasers and chips, applied in the field of lasers, can solve the problems of large overall errors in laser preparation and low laser alignment

Active Publication Date: 2021-04-09
QINGDAO HISENSE LASER DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The application provides a laser, which can solve the problems of large overall errors in the preparation of the laser and low collimation of the laser emitted by the laser

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Embodiment Construction

[0040] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0041] With the development of optoelectronic technology, lasers are used more and more widely. For example, lasers can be used in welding process, cutting process and laser projection. A laser includes many components, such as a carrier substrate, a heat sink, a prism, and a laser chip, etc., and each component is fixed by pasting or welding. Due to errors in the pasting or welding process of each component, the overall error in the preparation of the final laser is relatively large, and it is difficult for the laser emitted by the laser to achieve a predetermined degree of collimation. The following embodiments of the present application provide a carrier substrate, which can reduce the overall error in the preparation of a las...

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Abstract

The invention discloses a laser, and belongs to the technical field of photoelectricity. The laser comprises a tube shell, a bearing substrate, a plurality of laser chips and at least one prism; the bearing substrate, the plurality of laser chips and the at least one prism are arranged in the tube shell, and the plurality of laser chips and the at least one prism are arranged on one side, away from the tube shell, of the bearing substrate; the bearing substrate comprises a chip mounting area where the plurality of laser chips are located and a prism setting area where the at least one prism is located, and the prism setting area is recessed relative to the chip mounting area; each prism corresponds to one or more laser chips, is located on the light emitting side of the corresponding laser chip, and is used for reflecting light emitted by the corresponding laser chip. According to the invention, the problem of large total error of laser preparation is solved, and the collimation degree of light emitted by the laser is improved. The laser is used for light emitting.

Description

technical field [0001] This application relates to the field of optoelectronic technology, in particular to a laser. Background technique [0002] With the development of optoelectronic technology, lasers are widely used. [0003] The laser may include a tube shell, a carrier substrate, at least one heat sink and at least one laser chip, wherein the carrier substrate is arranged on the tube shell, the at least one heat sink is pasted on the carrier substrate, and each laser chip is pasted on a heat sink . The laser can also include a prism for adjusting the direction of the light emitted by the laser chip, which is usually also attached to the substrate. [0004] Since many pasting steps need to be carried out sequentially in the process of preparing the laser, and there will be pasting errors in each pasting step, therefore, the overall error of the preparation of the laser is relatively large, and the collimation of the laser emitted by the laser is low. Contents of th...

Claims

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Application Information

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IPC IPC(8): H01S5/0225H01S5/024H01S5/40
CPCH01S5/02469H01S5/4025H01S5/02253H01S5/02326H01S5/02315H01S5/4031H01S5/02255H01S5/02476H01S5/0206
Inventor 周子楠田有良杜光超韩继弘
Owner QINGDAO HISENSE LASER DISPLAY CO LTD
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