Packaging device and production method thereof

Abstract

The invention relates to the technical field of electronic components, and especially relates to a packaging device and a production method thereof. The packaging device comprises a lead frame and a packaging part, the lead frame comprises a connecting part and a plurality of mounting parts, any two adjacent mounting parts are connected through the connecting part, each mounting part is provided with a chip mounting surface, each connecting part is provided with a through hole, and the through holes are formed in the thickness direction of the lead frame in a penetrating mode; and the packaging part is arranged on the side, where the chip mounting surface is located, of the connecting part, and the packaging part is in plugging fit with the through hole. After the packaging device provided by the invention is subjected to a subsequent processing process, a soldering tin layer can be formed on the side surface of the formed packaging device monomer, so that relatively high connection reliability between the packaging device and a circuit board is ensured in a process of connecting the packaging device and the circuit board.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a packaging device and a production method thereof. Background technique [0002] With the gradual miniaturization of electronic components, the application range of QFN (Quad Flat No-lead Package, Quad Flat No-lead Package) is becoming wider and wider. However, after the current QFN is packaged and injected, all the pins will be surrounded by epoxy resin, and then in the process of electroplating the QFN, the tin layer can only be electroplated to the surface exposed to the epoxy resin, so that the QFN After the cutting and separation operation is completed, there is no electroless tin plating layer on the side of the pin. Due to the electroless tin plating layer on the side of the pin, when the QFN is applied to the terminal, the pin cannot be firmly soldered and connected to the PCB, and there is a high probability of The electrical connection failure between th...

AI Technical Summary

Problems solved by technology

However, after the current QFN is packaged and injected, all the pins will be surrounded by epoxy resin, and then in the process of electroplating the QFN, the tin layer can only be electroplated to the surface exposed to the epoxy resin, so that the QFN After the cutting and separation operation is completed, there is no electroless tin plating layer on the side of the pin. Due to the electroless tin plating layer on the side of the pin, when the QFN is applied to the terminal, the pin cannot be firmly soldered and connected to the PCB, and there is a high probability of There will be a failure of the electrical connection between the device and the PCB (Printed Circuit Board, printed circuit board)

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