Processing method for resin hole plugging of rigid-flex board of ultrathin printed circuit

A soft-rigid combination board and printed circuit technology, applied in printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve problems such as the inability to do resin plug hole technology, and the easy foaming of copper foil.

Pending Publication Date: 2021-04-16
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing ultra-thin flex-hard board still has the following disadvantages: the ultra-thin 4-layer thin board cannot be used for resin plugging process, t

Method used

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  • Processing method for resin hole plugging of rigid-flex board of ultrathin printed circuit
  • Processing method for resin hole plugging of rigid-flex board of ultrathin printed circuit
  • Processing method for resin hole plugging of rigid-flex board of ultrathin printed circuit

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Embodiment 1

[0041] A method for processing resin plug holes of an ultra-thin printed circuit-flex-rigid bonded board, comprising the following process steps:

[0042] S1. To make the soft board 1 of the printed circuit soft-rigid combination board. The supplier of the soft board material is Songyang Electronics, the model is A-1005RD, the thickness of the soft board is 0.025mm, and the thickness of the copper foil is 1 / 3 ounce 0.008 mm, the supplier of cover film 2 is Taihong, the model is FHK0515, as attached figure 1 shown;

[0043] S2. Paste a layer of cover film 2 on the bent parts of the upper and lower surface layers of the flexible board 1;

[0044] S3, as attached figure 2 As shown, prepare the PFG protective film and the pure glue adhesive, the thickness of the PFG protective film is 0.035mm, and the thickness of the pure glue is 0.025mm, and the PFG protective film and the pure glue are pre-pressed together to form a pre-pressed bonding film 5, and then Process it into the s...

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Abstract

The invention relates to a processing method for resin hole plugging of a rigid-flex board of an ultrathin printed circuit. According to the invention, cover films are attached to the bent parts of the upper surface layer and the lower surface layer of a flexible board, and a PFG protective film and pure glue which are pre-pressed together are attached to the cover films; then windowing treatment is carried out on the bent parts of the flexible board; then a copper foil, a prepreg, the flexible board, another prepreg and another copper foil are laminated in sequence from bottom to top; a layer of an RP190 auxiliary buffer pressing material is added to the each of the upper layer and the lower layer of the obtained laminated board, and then pressing is conducted so as to obtain a semi-finished product of the rigid-flex board; and the prepared ultrathin board can be subjected to a resin hole plugging process. Since the PFG protective film and the copper foil are bonded by pure glue carried in the bending area of the flexible board, so the copper foil in the flexible area does not foam during baking, the semi-finished product production of uncovering after resin hole plugging of the rigid-flex board combined board is completed, uncovering can be directly conducted before uncovering, the problem that copper foams in a baking flexible board area are poor after resin hole plugging in the prior art can be solved, product yield is increased, and production cost is reduced.

Description

technical field [0001] The invention relates to a processing method for a resin plug hole of an ultra-thin printed circuit flex-rigid board, in particular to a back-opening flex-hard board with a resin plug hole and laminated with ordinary flow glue PP. [0002] technical background [0003] With the development trend of thinner, integrated and multi-functional consumer electronic products, the requirements for the production process of printed circuit-flex-rigid boards are getting higher and higher. Following this trend, printed circuit boards will gradually become an important part of printed circuit boards. The advantages of this product are that it can save more design space, reduce assembly, and signal transmission is faster and more stable. However, the existing ultra-thin flex-hard board still has the following disadvantages: the ultra-thin 4-layer thin board cannot be used for resin plugging process, the copper foil in the soft board area is prone to foaming after res...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06H05K1/02
Inventor 华福德张志敏
Owner GULTECH WUXI ELECTRONICS CO LTD
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