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Method for manufacturing package lid member and method for manufacturing package

A manufacturing method and technology for cover parts, which are applied to semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc., can solve the problem of glass plate peeling or part of the glass plate being peeled off, damage to the cover part for packaging, and glass plate substrates. The effect of preventing peeling and breakage can be achieved by preventing problems such as falling off

Active Publication Date: 2021-04-16
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, when the Au-Sn paste is applied on a glass plate and reflowed, the Au-Sn layer may be peeled off from the glass plate or a part of the glass plate may be peeled off due to the difference in shrinkage during cooling, and the sealing cover member may may be damaged
Furthermore, the glass plate (lid member) bonded to the substrate by the Au-Sn layer may fall off from the substrate

Method used

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  • Method for manufacturing package lid member and method for manufacturing package
  • Method for manufacturing package lid member and method for manufacturing package
  • Method for manufacturing package lid member and method for manufacturing package

Examples

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Embodiment

[0089] The lid members for encapsulation were manufactured by the method of Examples 1-4 and Comparative Examples 1-4 which differed only in the process, and the Au-Sn layer formed in each lid member for encapsulation was compared. At first, prepare a piece of glass part 10 of 20mm * 20mm * 0.5mm in each example, and as Figure 14 As shown, Au plating with a thickness of 0.1 μm is performed on the surface of each glass member 10, thereby forming 25 square-shaped metallization layers 11 of 3.0 mm×3.0 mm×300 μm in width ( metallization process).

[0090] On each metallization layer 11 , an Au—Sn paste was applied in the same shape and size as the metallization layer 11 so as to cover the entire area of ​​the metallization layer 11 (paste coating step). The Au-Sn paste used Au-22 mass % Sn alloy powder with an average particle diameter of 7 μm, and the ratio of the flux to the entire paste was 10 mass %. The flux uses RA type.

[0091] In the paste coating process, in order to...

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Abstract

This method for manufacturing a package lid member includes a metalizing step of forming a metalized layer (4) on the surface of a glass member (30), a paste applying step of applying an Au-Sn paste on the metalized layer (4) in a frame shape, a reflow step of heating, after the paste applying step, the glass member (30) to which the Au-Sn paste has been applied to cause the Au-Sn paste to reflow, and a cooling step of cooling the glass member (30) after the reflow step to form an Au-Sn layer (5). The cooling step includes a retaining step of retaining the glass member (30) at a temperature range of 150 DEG C to 190 DEG C for two minutes or longer.

Description

technical field [0001] The present invention relates to a method of manufacturing a lid member for a package bonded to a package substrate and a method of manufacturing a package. [0002] This application claims priority based on Patent Application No. 2018-203063 filed in Japan on October 29, 2018 and Patent Application No. 2019-190241 filed in Japan on October 17, 2019, and the contents thereof are incorporated herein. Background technique [0003] Conventionally, there are known semiconductor devices and light-emitting devices in which light-emitting elements such as semiconductor lasers (LDs) and LEDs are sealed in packages to protect light-emitting elements such as semiconductor lasers (LDs) and LEDs from the outside environment (for example, refer to Patent Documents 1 and 2). [0004] The semiconductor device described in Patent Document 1 includes: a package substrate having a recess opening to the upper end; an optical semiconductor element housed in the recess; an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L33/48
CPCH01L33/48H01L23/02H01L33/486H01L2933/0033H01L23/08H01L23/10H01L23/13H01L33/483H01S5/022H01L33/0095
Inventor 大道悟宇野浩规
Owner MITSUBISHI MATERIALS CORP