UV viscosity-reducing adhesive film applied to PVC substrate and used for film reversion of semiconductor chip, and preparation method thereof

A semiconductor and adhesive film technology, which is applied in the field of PVC substrate UV adhesive film and its preparation, can solve the problems of residual adhesive in UV film, influence of UV adhesive stability, unstable product viscosity, etc., to achieve stable viscosity, The effect of high crosslink density

Inactive Publication Date: 2021-04-20
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high plasticizer contained in PVC, which will affect the stability of UV glue, most products have unstable viscosity and residual glue after the UV film is peeled off.

Method used

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  • UV viscosity-reducing adhesive film applied to PVC substrate and used for film reversion of semiconductor chip, and preparation method thereof
  • UV viscosity-reducing adhesive film applied to PVC substrate and used for film reversion of semiconductor chip, and preparation method thereof
  • UV viscosity-reducing adhesive film applied to PVC substrate and used for film reversion of semiconductor chip, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: as figure 1 Shown, a kind of PVC base material UV viscous-reducing adhesive film that is used for semiconductor chip inverted film, comprises base material layer 1, adhesive layer 2 and release film layer 3, and described adhesive layer 2 is positioned at base material layer 1 and release type Between layers 3, the substrate layer 1 is preferably a 70 μm PVC film, the release film layer 3 is a PET monosilicon release film with a thickness of 36 μm, and a release force of 15g / 25mm. Cloth is prepared by drying on the substrate layer 1, and the UV visbreaking glue includes the following components in parts by weight:

[0032] Acrylic glue 70 parts, UV monomer or oligomer 30 parts, curing agent 1.5 parts, photoinitiator 1.2 parts, plasticizer: 5 parts;

[0033] Wherein acrylic glue comprises following components by weight:

[0034] 80 parts of butyl acrylate, 10 parts of vinyl acetate, 6 parts of acrylic acid, 0.2 part of hydroxyethyl methacrylate, 0.5 part ...

Embodiment 2

[0043] like figure 1 Shown, a kind of PVC base material UV viscous-reducing adhesive film that is used for semiconductor chip inverted film, comprises base material layer 1, adhesive layer 2 and release film layer 3, and described adhesive layer 2 is positioned at base material layer 1 and release type Between layers 3, the substrate layer 1 is preferably a 70 μm PVC film, the release film layer 3 is a PET monosilicon release film with a thickness of 36 μm, and a release force of 20g / 25mm, and the adhesive layer 2 is UV viscous-reducing glue Coated on the substrate layer 1 and dried, the UV visbreaking glue includes the following components in parts by weight:

[0044] 60 parts of acrylic glue, 25 parts of UV monomer or oligomer, 0.9 parts of curing agent, 1.4 parts of photoinitiator, and 2 parts of plasticizer;

[0045] Wherein acrylic glue comprises following components by weight:

[0046] 70 parts of butyl acrylate, 5 parts of vinyl acetate, 3 parts of acrylic acid, 1 par...

Embodiment 3

[0055] like figure 1 Shown, a kind of PVC base material UV viscous-reducing adhesive film that is used for semiconductor chip inverted film, comprises base material layer 1, adhesive layer 2 and release film layer 3, and described adhesive layer 2 is positioned at base material layer 1 and release type Between layers 3, the substrate layer 1 is preferably a 70 μm PVC film, the release film layer 3 is a PET monosilicon release film with a thickness of 36 μm, and a release force of 10g / 25mm, and the adhesive layer 2 is UV viscous-reducing glue Coated on the substrate layer 1 and dried, the UV visbreaking glue includes the following components in parts by weight:

[0056] 70 parts of acrylic glue, 20 parts of UV monomer or oligomer, 2 parts of curing agent, 0.5 part of photoinitiator, and 10 parts of plasticizer;

[0057] Wherein acrylic glue comprises following components by weight:

[0058] 60 parts of butyl acrylate, 2 parts of vinyl acetate, 1 part of acrylic acid, 2 parts ...

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Abstract

The invention discloses an UV viscosity-reducing adhesive film applied to a PVC substrate and used for film reversion of a semiconductor chip. The UV viscosity-reducing adhesive film comprises a substrate layer, an adhesive layer and a release film layer, wherein the adhesive layer is positioned between the substrate layer and the release film layer, and the adhesive layer is prepared by coating the substrate layer with UV viscosity-reducing glue and conducting drying. The UV viscosity-reducing glue comprises the following components in parts by weight: acrylic acid glue, UV monomers or oligomers, a curing agent, a photoinitiator and a plasticizer, wherein the acrylic acid glue is prepared from the following components in parts by weight: butyl acrylate, vinyl acetate, acrylic acid, hydroxyethyl methacrylate and azodiisobutyronitrile. According to the invention, the hardness of the glue is effectively controlled through formula design of an acrylic polymer, oligomer selection and increase and decrease of a plasticizer content, and a designed formula is high in crosslinking density; the concentration of the plasticizer of the adhesive layer and the concentration of the plasticizer of the PVC layer are balanced by controlling the amount of the plasticizer, and after the adhesive layer is attached to the substrate layer, the adhesive layer cannot be affected by the plasticizer in the substrate layer; and therefore, the adhesive layer achieves the effects of stable viscosity and no adhesive residue.

Description

technical field [0001] The invention belongs to the technical field of UV-viscosity-reducing adhesive films, and in particular relates to a UV-viscosity-reducing adhesive film on a PVC substrate used for semiconductor chip inversion films and a preparation method thereof. Background technique [0002] The production of semiconductors and LED chips will go through links such as cutting, film pouring, turnover, and film expansion. Cutting protective film is mostly PVC blue film with a viscosity of about 80g / 25mm. After the chip is cut in some packaging factories, the cut chip is turned over to another blue film and shipped with a composite grid release film. In particular, for large-sized chips, it is difficult to pour the film smoothly with ordinary blue film, and the viscosity of the blue film has little difference. If the peeling force of the blue film is increased blindly, it will make it difficult to separate the chips when picking them up. Therefore, the development of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/24C09J4/02C09J4/06C09J11/06H01L21/683C08F220/18C08F218/08C08F220/06C08F220/20
Inventor 李阜阳陈炼朱玲玲陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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