Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic gas preparation system and method based on chip and intelligent manufacturing

A technology of electronic gas and intelligent manufacturing, which is applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., and can solve the problems of high equipment cost, doping of reactants with impurities, and affecting the purity of electronic gas, etc.

Inactive Publication Date: 2021-04-23
刘振宇
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The materials in the preparation process of existing electronic gases (such as silane gas) generally require complex chemical reactions to be prepared. During the preparation process, multiple processes are required to operate separately. Impurities affect the purity of electronic gas, and the high cost of equipment is caused by numerous processes. Therefore, we propose an electronic gas preparation system and method based on chips and intelligent manufacturing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic gas preparation system and method based on chip and intelligent manufacturing
  • Electronic gas preparation system and method based on chip and intelligent manufacturing
  • Electronic gas preparation system and method based on chip and intelligent manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] see figure 1 , figure 2 and image 3 , the present invention provides a technical solution: an electronic gas preparation system based on chips and intelligent manufacturing, including a base plate 1 and a support frame 2, one end of the top of the base plate 1 is fixedly installed with a support frame 2, and also includes: a first The processing mechanism 3, the second processing mechanism 4, the quantitative unloading mechanism 5, the feeding mecha...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of key electronic gas raw materials and intelligent preparation, in particular to an electronic gas preparation system and method based on a chip and intelligent manufacturing. The system comprises a bottom plate and a supporting frame, and further comprises a first treatment mechanism, a second treatment mechanism, quantitative discharging mechanisms, feeding mechanisms, a cooling mechanism, a liquid nitrogen recovery mechanism, a molecular sieve treatment mechanism, a deep purification mechanism and an electronic gas storage tank, and supporting frames are fixedly mounted at one end of the top of the bottom plate; the first treatment mechanismand the second treatment mechanism are arranged at the top end and the lower end of the interior of the supporting frames respectively, the quantitative discharging mechanisms are arranged at the position, located at the top of the first treatment mechanism, inside the supporting frames and connected with the first treatment mechanism, and the feeding mechanisms are arranged at the positions, located on the side edges of the two supporting frames, of the top of the bottom plate respectively; and the two feeding mechanisms are connected with the two quantitative discharging mechanisms respectively. The system is high in utilization rate, low in cost consumption and high in electronic gas preparation efficiency.

Description

technical field [0001] The invention relates to the technical field of key electronic gas raw materials and intelligent preparation, specifically an electronic gas preparation system and method based on chips and intelligent manufacturing. Background technique [0002] Electronic gas is used in the chip manufacturing process. Electronic gas is an indispensable raw material for the production of electronic industries such as VLSI, flat-panel display devices, compound semiconductor devices, solar cells, and optical fibers. They are widely used in thin films, etching, and doping. Silane is a very important high-purity silicon source gas in the microelectronics industry. Its unique molecular structure and physical and chemical properties make it play an important role in the modern microelectronics industry and material science and technology. role. [0003] The materials in the preparation process of existing electronic gases (such as silane gas) generally require complex chem...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/04
CPCC01B33/04C01B33/046
Inventor 汪海燕刘振宇林素贞
Owner 刘振宇
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products