Unlock instant, AI-driven research and patent intelligence for your innovation.

A light emitting unit and a light emitting module

A technology of light-emitting unit and light-emitting module, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., and can solve problems such as packaging difficulties and poor current conductivity

Active Publication Date: 2021-07-06
BEIJING IVISUAL 3D TECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present disclosure provide a light-emitting unit and a light-emitting module to solve the technical problems of poor current conductivity and difficult packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A light emitting unit and a light emitting module
  • A light emitting unit and a light emitting module
  • A light emitting unit and a light emitting module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, at least one embodiment can be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.

[0046] Such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, an embodiment of the prese...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This application relates to the field of semiconductor technology, and discloses a light-emitting unit, including: a light-emitting semiconductor, including a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked from bottom to top, and the second semiconductor layer is sunken to the The sunken structure of the first semiconductor layer; the transparent conductive layer is arranged on the top surface of the second semiconductor layer; the insulating layer is arranged on the top surface of the transparent conductive layer and in the sunken structure; the top surface of the insulating layer is located on the top surface of the transparent conductive layer Above the plane where the surface is located; wherein, the light-emitting unit is provided with a first hole that penetrates the insulating layer and reaches the first semiconductor layer; and a second hole penetrates the insulating layer and reaches the transparent conductive layer; the light-emitting unit also includes a first electrode and The second electrodes are respectively arranged in the first hole and the second hole. The light emitting unit provided in the present application can increase the current conductivity in the light emitting unit. The application also discloses a lighting module.

Description

technical field [0001] The present application relates to the technical field of semiconductors, for example, to a light emitting unit and a light emitting module. Background technique [0002] At present, there are problems of poor current conduction inside the light-emitting unit and uneven current conduction; in addition, there are also packaging difficulties caused by the fact that the height of a part of the top surface of the insulating layer is lower than that of the second semiconductor layer and the integration with other components Difficult connection problem. Contents of the invention [0003] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. This summary is not intended to be an extensive overview or to identify key / critical elements or to delineate the scope of these embodiments, but rather serves as a prelude to the detailed description that follows. [0004] Embodiments of the prese...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/44H01L33/14H01L33/48H01L25/16H01L25/00
CPCH01L25/167H01L25/50H01L33/14H01L33/44H01L33/48
Inventor 不公告发明人
Owner BEIJING IVISUAL 3D TECH CO LTD