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Full-automatic intelligent semiconductor chip marking equipment

A marking equipment and semiconductor technology, applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve problems such as inability to meet mass chip production and low efficiency

Inactive Publication Date: 2021-04-27
深圳爱仕特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the existing laser marking machine is working, the work is first placed on the workbench matched with the laser marking machine, and then the laser marking machine uses a high-energy-density laser to irradiate a certain part of the workpiece to vaporize the surface material Or a chemical reaction of color change, thereby leaving a permanent mark. After the laser marking of a workpiece is completed, the workpiece is replaced manually for the next marking. Therefore, its efficiency is low and cannot meet the production of large-scale chips.

Method used

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  • Full-automatic intelligent semiconductor chip marking equipment
  • Full-automatic intelligent semiconductor chip marking equipment
  • Full-automatic intelligent semiconductor chip marking equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0022] Such as Figure 1-Figure 4 One embodiment described above: a fully automatic intelligent semiconductor chip marking equipment, including a working board, on which a feeding device 1, a feeding device 2, a flipping device 3, a gripper device 4 and a marking device are respectively arranged on the working board. Marking device 5, the turning device 3 is arranged in the middle of the working plate, the feeding device 1 and the unloading device 2 are arranged on both sides of the turning device 3, and the clamping device 4 is arranged above the turning device 3, and the A marking device 5 is arranged on the rear side of the turning device 3, and a marking protective cover is arranged on the working plate; firstly, the material is loaded from the feeding device 1, and then placed on the turning and transposing by the clamping device 4, marking Device 5 marks the front and back sides of the flipped products, and the marked products are picked up by the gripper device 4 and pl...

Embodiment 2

[0029] The difference between the second embodiment and the above is that the moving assembly is set as an electric cylinder.

Embodiment 3

[0030] The third embodiment differs from the above in that the marking device 55 can be a laser marking machine.

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Abstract

The invention discloses full-automatic intelligent semiconductor chip marking equipment. The full-automatic intelligent semiconductor chip marking equipment comprises a working plate; a feeding device, a discharging device, a turnover device, a clamping jaw device and a marking device are separately arranged on the working plate; the turnover device is arranged in the middle of the working plate; the feeding device and the discharging device are arranged on the two sides of the turnover device respectively; the clamping jaw device is arranged above the turnover device; the marking device is arranged on the rear side of the turnover device; and a marking protective cover is arranged on the working plate. The reject ratio is low, the cost is low, and the requirements of customers can be met in time.

Description

technical field [0001] The invention relates to the field of marking technology processing, in particular to a fully automatic intelligent semiconductor chip marking equipment. Background technique [0002] Marking In the production, according to the relevant national regulations or the enterprise's own management needs, mark the text and pictures on the product, such as: production date, validity period, product number, etc. This process is called marking. In the process of equipment processing and marking, most products are marked by manual operation, while a small number of equipment can mark products, but only one product can be marked at a time, the processing process is slow, and the workload of manual operation Large, high defective rate, high cost, unable to meet the mass demand of customers. Due to the advantages of high marking accuracy, fast processing speed, low cost, high level of automation, no mechanical extrusion or mechanical stress damage to the processed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/70
CPCB23K26/362B23K26/702
Inventor 姚金才朱超群陈宇
Owner 深圳爱仕特科技有限公司