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Manufacturing mold and manufacturing method of conductivity probe of temperature and salt depth measuring instrument

A technology of conductivity probe and manufacturing method, which is applied in the field of sensors, can solve problems such as inability to ensure gap sealing, poor pressure resistance performance of the probe, and damage to the temperature, salt and depth measuring instrument, so as to achieve simple structure of the probe, ensure pressure resistance performance, and high performance stable effect

Active Publication Date: 2022-04-01
SHANDONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] During the production process of the existing conductivity probe, such as figure 1 and figure 2 As shown, the positioning tube 5 is used to pass through the middle of the magnetic ring 1, and after the magnetic ring 1 is fixed, the magnetic ring 1 is wrapped with hot-melt resin 3 to make a probe, but there are a series of problems in the probe made by this method, for example, due to It is impossible to ensure that the thickness of the solidified hot-melt resin 3 on the outer layer of the magnetic ring 1 is uniform, resulting in the inconsistency of the pressure resistance performance of the probe in all directions, resulting in poor pressure resistance of the probe; because the positioning tube 5 needs to be fixed and positioned when the magnetic ring 1 is packaged, resulting in After the packaging is completed, there will be a gap between the joint of the positioning tube and the probe shell 6. Due to technological problems, it cannot be guaranteed that the gap will be completely sealed. Therefore, there is a certain probability that the probe will leak, which will cause the temperature, salt and depth measuring instrument damaged by water

Method used

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  • Manufacturing mold and manufacturing method of conductivity probe of temperature and salt depth measuring instrument
  • Manufacturing mold and manufacturing method of conductivity probe of temperature and salt depth measuring instrument
  • Manufacturing mold and manufacturing method of conductivity probe of temperature and salt depth measuring instrument

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0034] The invention provides a mold for making a conductivity probe of a temperature, salt and depth measuring instrument, comprising an upper template 7 and a lower template 8, such as Figure 5 , Figure 6 and Figure 7 As shown, both the upper template 7 and the lower template 8 are provided with a primary packaging positioning cavity 9 and a secondary packaging positioning cavity 10 for accommodating the magnetic ring 1 and the base 2, and the primary packaging positioning cavity 9 and the secondary packaging positioning cavity 10 Runners 11 are opened in between, and the primary packaging positioning cavity 9 includes a vertical positioning groove 12 for accommodating the magnetic ring 1 and a horizontal positioning groove 13 for accommodating the base 2, and the vertic...

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Abstract

The invention discloses a manufacturing mold and a manufacturing method for a conductivity probe of a temperature, salt, and depth measuring instrument. The mold includes an upper template and a lower template, and the upper template and the lower template are provided with primary package positioning for accommodating a magnetic ring and a base. The cavity and the secondary package positioning cavity have a flow channel between them. Both the primary package positioning cavity and the secondary package positioning cavity include a vertical positioning groove for accommodating the magnetic ring and a horizontal positioning groove for accommodating the base; Sliders are arranged on both sides of the vertical positioning groove on the lower template, and the primary packaging positioning column and the secondary packaging positioning column are oppositely arranged on the slider facing the direction of the vertical positioning groove. The primary packaging positioning column is located at the vertical positioning of the primary packaging positioning cavity. On both sides of the groove, the secondary packaging positioning posts are located on both sides of the vertical positioning groove of the secondary packaging positioning cavity. The structure of the conductivity probe manufactured by the mold and the method disclosed in the invention is simpler, can realize complete sealing, and completely solves the hidden danger of water leakage of the conductivity probe.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a manufacturing mold and a manufacturing method of a conductivity probe of a temperature, salt and depth measuring instrument. Background technique [0002] Conductivity, Temperature, Depth (Conductivity, Temperature, Depth) measuring instrument is used to measure three basic physical parameters of water body temperature, depth and conductivity. According to these three parameters, various other physical parameters can also be calculated, such as the speed of sound, etc., which is a necessary equipment for the investigation of oceans and other water bodies. [0003] The temperature, salinity and depth measuring instrument includes three sensors, which are temperature sensor, pressure sensor and conductivity sensor, and the conductivity probe is the sensor used to measure the conductivity of water body. [0004] Conductivity sensors are divided into electrode type and electromagn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/14G01N27/06B29L31/34
CPCB29C45/14065B29C45/14819G01N27/06B29L2031/34
Inventor 杜立彬李正宝吕婧陈光源孟祥谦
Owner SHANDONG UNIV OF SCI & TECH
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