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Field-specific software-defined wafer level system and prefabricated member interconnection and integration method

A software-defined, prefabricated technology, used in semiconductor/solid-state device components, electrical components, electrical solid-state devices, etc., can solve the problems of complex simulation work and limited application, and achieve delaying Moore's Law, clear structure, and shared design. effect of difficulty

Active Publication Date: 2021-04-30
CHINA NAT DIGITAL SWITCHING SYST ENG & TECH R&D CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problems of limited application and complicated simulation work existing in the existing prefab interconnection and integration methods, the present invention provides a field-specific software-defined wafer-level system and a field-specific prefab applied to the system Interconnection and Integration Methods

Method used

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  • Field-specific software-defined wafer level system and prefabricated member interconnection and integration method
  • Field-specific software-defined wafer level system and prefabricated member interconnection and integration method
  • Field-specific software-defined wafer level system and prefabricated member interconnection and integration method

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Embodiment 1

[0038] Such as figure 2 As shown, the embodiment of the present invention provides a field-specific software-defined wafer-level system, including: an on-chip interconnection network located on a silicon wafer and an on-chip interconnection network located outside the silicon wafer and connected to the on-chip interconnection network through a wafer External expansion network connected by micro-bumps;

[0039] Such as image 3 As shown, the on-chip interconnection network includes a plurality of on-chip interconnection prefabricated parts, and each on-chip interconnection prefabricated part is connected by an advanced technology of on-chip interconnection (for example, silicon interconnection structure Si-IF);

[0040] Such as Figure 4 As shown, the external extension network includes external interconnection prefabs, processing prefabs and storage prefabs, and the external interconnection prefabs, processing prefabs and storage prefabs are all connected to the on-chip Th...

Embodiment 2

[0048] In order to form the above domain-specific software-defined wafer-level system, an embodiment of the present invention also provides a domain-specific prefab interconnection and integration method. The key to the interconnection and integration of prefabricated parts in the field-specific SoW system lies in the prefabricated parts and the interconnection network. In the field-specific software-defined wafer-level system provided by the present invention, the prefabricated parts include interconnected prefabricated parts, processing prefabricated parts and There are three types of storage prefabricated parts, and interconnection prefabricated parts can be divided into two types: on-chip interconnection prefabrication and external interconnection prefabrication; Parts can be made with different processes.

[0049] The interconnection and integration method provided by the embodiment of the present invention includes an interconnection and integration rule based on an on-c...

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Abstract

The invention provides a field-specific software-defined wafer level system and a prefabricated part interconnection and integration method. The system comprises an on-chip interconnection network located on a silicon wafer and an external expansion network located outside the silicon wafer and connected with the on-chip interconnection network through on-chip micro bumps. The on-chip interconnection network comprises a plurality of on-chip interconnection prefabricated parts, and the on-chip interconnection prefabricated parts are connected by adopting an on-chip interconnection advanced technology; the external expansion network comprises an external interconnection prefabricated part, a processing prefabricated part and a storage prefabricated part, and the external interconnection prefabricated part, the processing prefabricated part and the storage prefabricated part are connected with the on-chip interconnection prefabricated part through on-chip micro bumps; and the on-chip interconnection prefabricated part and the external interconnection prefabricated part are interconnection prefabricated parts, and the interconnection prefabricated parts, the processing prefabricated part and the storage prefabricated part are the prefabricated parts obtained by dividing the prefabricated parts for service processing in the special field according to interconnection, processing and storage functions for service processing in the special field.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a field-specific software-defined wafer-level system, and a field-specific prefab interconnection and integration method applied to the system. Background technique [0002] With the development of integrated circuits, the continuation of Moore's Law is facing more and more challenges, and integrated circuits have entered the post-Moore era, supporting the system on wafer (SoW) of heterogeneous heterogeneous and heterogeneous chip interconnection, It can effectively solve the development difficulties faced by ultra-large-scale chips and large-scale information infrastructure, and the advanced interconnection technology based on SoW can play a great role in special fields. Such as figure 1 Shown is the interconnection model of multiple interconnected dies in special fields such as high-performance computing, network switching, artificial intelligence, and 5G data proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/528H01L23/58
CPCH01L23/528H01L23/58
Inventor 刘勤让邬江兴李沛杰沈剑良吕平魏帅张霞刘冬培张丽高彦钊
Owner CHINA NAT DIGITAL SWITCHING SYST ENG & TECH R&D CENT