A domain-specific software-defined wafer-level system and prefab interconnection and integration method

Abstract

The invention provides a field-specific software-defined wafer-level system and a prefabricated component interconnection and integration method. The system includes: an on-chip interconnect network located on the silicon wafer and an external extended network located outside the silicon wafer and connected to the on-chip interconnect network through on-chip micro-bumps; the on-chip interconnect network includes multiple On-chip interconnection prefabs, each on-chip interconnection prefab is connected by advanced technology of on-chip interconnection; the external expansion network includes external interconnection prefabs, processing prefabs and storage prefabs, the external interconnection prefabs The processing prefab, the processing prefab and the storage prefab are all connected to the on-chip interconnection prefab through on-chip micro-bumps; wherein, the on-chip interconnection prefab and the external interconnection prefab are all interconnection prefabs , the interconnection prefab, the processing prefab and the storage prefab refer to the prefabs obtained by dividing the prefabs of the business processing in the dedicated domain according to the interconnection, processing and storage functions of the business processing in the dedicated domain.

Description

Technical field [0001] The present invention relates to the field of integrated circuit technology, particularly to a software-defined domain-specific wafer-level system, and is applied to the preform dedicated interconnect integration method of the art system. Background technique [0002] With the development of integrated circuits, a continuation of Moore's Law is facing increasing challenges, Hou Moer entered the era of integrated circuits, crystal support heterogeneous systems on heterogeneous core particle interconnect different process (System on Wafer, SoW), can effectively solve large scale integrated chip and large-scale information infrastructure development facing difficulties, based on advanced interconnect technologies SoW can play a significant role in a dedicated area. like figure 1 FIG Interconnection plurality of interconnected grains Die dedicated HPC art, switching network, and artificial intelligence data processing 5G. As can be seen, the dedicated interconn...

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problems of limited application and complicated simulation work existing in the existing prefab interconnection and integration methods, the present invention provides a field-specific software-defined wafer-level system and a field-specific prefab applied to the system Interconnection and Integration Methods

Images