Heat dissipation protection shell based on wireless reverse power supply

A technology of reverse power supply and protective shell, which is applied in the direction of electrical components, circuit devices, telephone structures, etc., can solve the problems of heat dissipation as soon as possible, discomfort, safety hazards, etc., and achieve the effect of improving heat dissipation efficiency and reducing volume thickness

Pending Publication Date: 2021-04-30
郭晓聪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous update and iteration of smart phones and tablet PCs, the main frequency of the chip is getting higher and higher, the network speed is getting faster and faster, and the functions are getting more and more. It is inevitable that the use of mobile phones and tablet PCs will generate huge Heat, when the mobile phone is running, the current output by the battery will generate heat when it passes through the internal components of the mobile phone and tablet computer. The main components that generate heat in the mobile phone and tablet computer are the processor, motherboard and battery. When the processor runs for a long time, the power will continue to increase, and the heat in the internal motherboard and other areas will also continue to increase. The heat generated by these components is due to the current high concentration and integration of mobile phones and tablet computers. Cooling in contact with the air is not effective under heavy use, and the excessively concentrated internal heat is also concentrated due to continuous use, and the heat cannot be dissipated as soon as possible in a short period of time. Therefore, people use mobile phones and tablets to process If you do a lot of tasks or play games, you will feel that the mobile phone is very hot when you connect external devices such as VR glasses, and you will feel uncomfortable and unsafe when holding th

Method used

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  • Heat dissipation protection shell based on wireless reverse power supply
  • Heat dissipation protection shell based on wireless reverse power supply
  • Heat dissipation protection shell based on wireless reverse power supply

Examples

Experimental program
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Effect test

Embodiment

[0040] Such as Figure 9 , the present embodiment selects the heat dissipation structure combining air cooling and semiconductor, and in structural design, water-cooling related components are removed, that is, the water-cooling protruding joint 22 and the water-cooling concave interface are removed from the temperature-conducting metal sheet 2 26 on the temperature-conducting film 31 One 23 and liquid circulation pipeline one 25, the hollowed out area 2 17 and the hollowed out area 3 18 are removed from the heat insulating layer 21, the liquid circulation pump 10, the water-cooling raised joint 11, and the liquid circulation pipeline are removed from the temperature conducting metal sheet 15 Two 39, hollow area one 12, water-cooling protruding joint three 40, so that the current generated by the wireless charging coil 28 is used to supply power to related structures in the air-cooling and semiconductor heat dissipation modes.

[0041] In addition, the terms "first" and "secon...

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PUM

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Abstract

The invention discloses a heat dissipation protection shell based on wireless reverse power supply, which comprises a buckle type base, wherein the buckle type base has a hollow region V, a plurality of layers of component fixing and clamping grooves are formed in the inner shell wall of the buckle type base, the component fixing and clamping grooves are processed in the inner shell wall of the buckle type base in an injection molding integral molding mode, and the specifications of the component fixing and clamping grooves are matched with that of the buckle type base; a temperature conducting film matched with the specification is additionally arranged in each component fixing and clamping groove, a round camera hollowed-out region IV is arranged on each temperature conducting film, and a wireless charging coil mounting groove is formed in one side of each camera hollowed-out region IV. Compared with the prior art, the heat dissipation protection shell has the advantages that the built-in wireless reverse charging function of a mobile phone or tablet personal computer is used for supplying power to the mobile phone or tablet personal computer, the mobile phone or tablet personal computer can directly work without a built-in battery and an external wire, adverse factors such as the size and the thickness are reduced, the heat dissipation efficiency is improved, and corresponding heat dissipation strength is provided for corresponding heat productivity.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation protective case based on wireless reverse power supply. Background technique [0002] With the continuous update and iteration of smart phones and tablet PCs, the main frequency of the chip is getting higher and higher, the network speed is getting faster and faster, and the functions are getting more and more. It is inevitable that the use of mobile phones and tablet PCs will generate huge Heat, when the mobile phone is running, the current output by the battery will generate heat when it passes through the internal components of the mobile phone and tablet computer. The main components that generate heat in the mobile phone and tablet computer are the processor, motherboard and battery. When the processor runs for a long time, the power will continue to increase, and the heat in the internal motherboard and other areas will also continue to increase. The heat gene...

Claims

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Application Information

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IPC IPC(8): H02J50/10H04M1/18H05K7/20
CPCH04M1/18H05K7/20172H05K7/20209H05K7/20272H02J50/10
Inventor 郭晓聪
Owner 郭晓聪
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