Gluing method for electronic component

Abstract

The invention provides a gluing method for an electronic component. The gluing method comprises the following steps that materials are prepared, specifically, a glue model is selected; a gluing head is selected, and the aperture of the gluing head is determined according to the size of the electronic component and the distance between adjacent pins on the electronic component; glue moistening is conducted, specifically, primary glue moistening is conducted on the pins of the electronic component so as to enable the pins of the electronic component and gaps between the pins to be coated with glue; and glue coating is conducted, specifically, the whole electronic component is coated with glue, so that the whole electronic component is sealed by the glue. According to the gluing method for the electronic component, the pins are moistened with glue before the electronic component is subjected to glue coating, air bubbles likely to be formed in the gaps of the pins due to direct glue coating can be avoided, a layer of glue can be firstly formed in the gaps between the pins through glue coating, the height difference between an electronic component body and the pins and the height difference between the pins are reduced, glue coating is carried out on the same plane as much as possible, bubbles in the glue coating process can be effectively reduced, and the performance of a product is improved.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic components, in particular to a method for gluing electronic components. Background technique [0002] Although electronic products are constantly updated, electronic components are indispensable parts of each product. Whether it is a high-frequency circuit board, low-frequency circuit board or control circuit board, electronic components need to be protected against moisture, water and dust during use. deal with. The product needs to prevent collision and compression during the production process; during the production process, it is necessary to prevent short circuit caused by partial exposure of electronic components, as well as tin migration under high temperature and high humidity conditions; in order to prevent the occurrence of the above abnormal points, ensure that the product Quality, at present, UV glue is introduced in the production process chamber to cover and wrap the...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a method for gluing electronic components, which effectively solves the technical problems of existing electronic components such as easy glue bubbles between pins in the process of gluing, poor protection and insulation effects of electronic components, etc.

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