Multi-layer stacked packaging structure and preparation method of multi-layer stacked packaging structure

Abstract

An embodiment of the invention provides a multi-layer stacked packaging structure and a preparation method of the multi-layer stacked packaging structure, and relates to the field of chip packaging. The multi-layer stacked packaging structure comprises a substrate, a first substrate chip, a second substrate chip, a plurality of first structure chips, a plurality of second structure chips and a plastic package body, wherein the first substrate chip and the second substrate chip are symmetrically mounted, meanwhile, the plurality of first structure chips are spirally stacked to form a first spiral structure, and the plurality of second structure chips are spirally stacked to form a second spiral structure, so that the plurality of first structure chips and the plurality of second structure chips rotate and are upwards stacked in a staggered manner. By adopting the central symmetry and spiral stacking mode, the plurality of second structure chips can be stacked on the first substrate chip at the same time, the stacking number is increased, the packaging size is reduced, heat dissipation and routing of the structure are facilitated through the spiral staggered stacking mode, meanwhile, the stability of the structure is guaranteed, and the integration degree of the product is increased.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a multilayer stack packaging structure and a preparation method of the multilayer stack packaging structure. Background technique [0002] With the rapid development of the semiconductor industry, the miniaturization of electronic products is becoming thinner and thinner to meet the needs of users and the product performance and memory are getting higher and higher. Therefore, the semiconductor packaging structure adopts multiple chip stacking (Stack-Die) technology or chip The FOW (flow over wire) technology stacks two or more chips in a single package structure to reduce the size of the product package and improve product performance. This kind of stacked product (memory card / memory card) usually has two types of chips, a memory chip and a control chip, which are packaged in the same substrate unit by stacking, which cannot effectively use the two-dimensional / three-dimen...

AI Technical Summary

Problems solved by technology

This kind of stacked product (memory card / memory card) usually has two types of chips, a memory chip and a control chip, which are packaged in the same substrate unit by stacking, which cannot effectively use the two-dimensional / three-dimensional rotating space for stacking , For example: NAND products require a large enough product capacity and a large number of stacked layers, and the performance of its memory card is limited by the number of memory chips and the size of the stacked structure

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