Micro OLED display structure and preparation method thereof

Abstract

The invention relates to a Micro OLED display structure and a preparation method thereof, and belongs to the technical field of micro OLED display. The Micro OLED display structure comprises a circuit substrate and a multi-film layer structure covering the circuit substrate, wherein the multi-film layer structure is formed by covering the circuit substrate with a plurality of mask plates through evaporation in sequence, the circuit substrate is provided with a plurality of annular enclosing walls, the two sides of the outer edge of a mask hole of each mask plate are each provided with an annular enclosing wall, and an annular groove for accommodating particle is formed between the two annular enclosing walls. The Micro OLED display structure has the beneficial effects that the display structure is simple in overall structure and simple in machining technology, the particle on the edges of the mask plates in the evaporation process can be stored in a centralized mode, the particle is prevented from drifting around in the evaporation process, and the packaging reliability, the product quality and the structural strength are improved.

Description

technical field [0001] The invention relates to the field of micro OLED display technology, in particular to a Micro OLED display structure and a preparation method thereof. Background technique [0002] Micro OLED (Organic Light Emitting Display) is a micro OLED display technology, mainly used in special military displays (gun sights, individual combat helmet displays, pilot helmets, etc.) , aerial photography, etc.), Micro OLED has the advantages of small size, light weight, low power consumption, high contrast, high resolution, etc., and is expected to usher in explosive growth in the next few years. [0003] In the process of Micro OLED, TFE (Thin Film Encapsulation, thin film encapsulation) technology is needed, mainly to isolate water and oxygen and protect the luminescent material from corrosion. However, in the current industry, particles are likely to be generated on the edge of the mask plate during the evaporation process, and the particles fall onto the substrat...

AI Technical Summary

Problems solved by technology

However, in the current industry, particles are likely to be generated on the edge of the mask plate during the evaporation process, and the particles fall onto the substrate. During the evaporation process and the subsequent process, the particles may float around, and the existence of particles will pierce the packaging film layer. Provide water and oxygen intrusion path, reduce packaging reliability

Images