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Pouring type resin-based distributed optical fiber sensor packaging device

A distributed optical fiber and packaging device technology, applied in the field of distributed optical fiber sensors, can solve problems such as difficulty in realizing large-sized product preparation, and achieve the effects of good adhesion, good product flexibility, and long service life.

Active Publication Date: 2021-05-11
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that the existing casting molding process is difficult to realize the preparation of large-scale products, and provides a casting resin-based distributed optical fiber sensor packaging device

Method used

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  • Pouring type resin-based distributed optical fiber sensor packaging device
  • Pouring type resin-based distributed optical fiber sensor packaging device
  • Pouring type resin-based distributed optical fiber sensor packaging device

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specific Embodiment approach 1

[0028] Specific implementation mode one: the following combination Figure 1-Figure 5 Describe this embodiment, a casting type resin-based distributed optical fiber sensor packaging device described in this embodiment, which includes: a casting mold 1, a vulcanization platform 2, an operating platform 9, a heat shield 5, a heating tube 3 and a temperature control box 6;

[0029] A heat insulation board 5 is laid on the top of the operating platform 9, and a pouring mold 1 and a vulcanization platform 2 are arranged at intervals on the heat insulation board 5. Grooves are arranged under the pouring mold 1 and the vulcanization platform 2, and heating pipes 3 are laid in the grooves. , the heating end of the heating pipe 3 is connected with the temperature control box 6 .

[0030] In this embodiment, the casting mold 1 and the vulcanization platform 2 are arranged at intervals, and the number of combinations is not limited. The segmented molding and vulcanization process is use...

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Abstract

The invention discloses a pouring type resin-based distributed optical fiber sensor packaging device, and belongs to the technical field of distributed optical fiber sensors. The pouring type resin-based distributed optical fiber sensor packaging device aims to solve the problem that large-size products are difficult to prepare through an existing pouring type forming process. The pouring type resin-based distributed optical fiber sensor packaging device comprises pouring molds, vulcanization platforms, an operation rack, a heat insulation plate, heating pipes and a temperature control box, wherein the heat insulation plate is laid above the operation rack, the pouring molds and the vulcanization platforms are laid on the heat insulation plate at intervals, grooves are formed below the pouring molds and the vulcanization platforms, the heating pipes are laid inside the grooves, and the heat supply ends of the heating pipes are connected with the temperature control box; and the pouring type resin-based distributed optical fiber sensor packaging device further comprises temperature sensors, wherein the temperature sensors are arranged inside holes reserved in the side surfaces of the pouring molds and used for monitoring the temperature of the molds in real time and transmitting the temperature obtained through real-time monitoring to the temperature control box. The pouring type resin-based distributed optical fiber sensor packaging device is used for packaging distributed optical fibers or quasi-distributed optical fiber grating strings by various types of pouring type resin.

Description

technical field [0001] The invention relates to a pouring resin-based distributed optical fiber sensor packaging device, which belongs to the technical field of distributed optical fiber sensors. Background technique [0002] Compared with traditional sensors, optical fiber sensors have the advantages of light weight, small size, high sensitivity, corrosion resistance, anti-electromagnetic interference, and distributed or quasi-distributed measurement. It can be applied in many fields such as petrochemical industry, civil construction, aerospace and so on. [0003] Common fiber optic sensors can be divided into point fiber optic sensors and distributed fiber optic sensors. Among them, distributed optical fiber sensors include quasi-distributed and fully distributed from a broad perspective. The sensors of point-type optical fiber sensing technology are discretely arranged in local positions of the structure, which can accurately measure the local strain, temperature, and p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C39/10B29C39/26B29C39/22B29C35/02
CPCB29C39/10B29C39/26B29C39/22B29C35/02
Inventor 马宪永张冀雯董泽蛟任前龙
Owner HARBIN INST OF TECH
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