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Tray device capable of adjusting thickness of wafer edge film

An edge film and tray technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve difficulties, affect the thickness of the wafer edge film, and affect the uniformity of film formation, etc.

Pending Publication Date: 2021-05-11
PIOTECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the prior art, there are multiple wafers carried on the wafer tray device, and in the process of film deposition, due to various factors, the heating of the wafers during the reaction process is uneven, which affects the uniformity of film formation. which in turn affects the thickness of the wafer edge film
Generally, conventional technologies need to rely on process recipes to adjust the thickness of the wafer edge film. However, this method is relatively difficult. Therefore, it is necessary to develop a structure that is relatively simple and convenient to adjust the film thickness of the wafer edge.

Method used

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  • Tray device capable of adjusting thickness of wafer edge film
  • Tray device capable of adjusting thickness of wafer edge film
  • Tray device capable of adjusting thickness of wafer edge film

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Embodiment Construction

[0026] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0027] figure 1 It is a schematic diagram showing one of the wafer carrying platforms of the pallet device capable of adjusting the film thickness of the wafer edge according to the present invention, as shown in figure 1 As shown, the tray device 100 includes a plurality of wafer carrying platforms 10, and each crystal pattern carrying platform 10 has an opening 11, and the opening 11 is used ...

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Abstract

The invention relates to a tray device capable of adjusting the thickness of a wafer edge film. The tray device comprises a plurality of wafer bearing tables, each wafer bearing table is provided with an opening, and the edge of the opening is provided with an abutting part and a first inclined part extending upwards from the abutting part to the surface of the wafer bearing table. The thickness of the edge film of the wafer is adjusted by changing the inclination angle and height of the first inclined part.

Description

technical field [0001] The invention relates to the application technical field of semiconductor thin film equipment, in particular to a tray device that can adjust the film thickness of the edge of a wafer in the process of semiconductor thin film deposition and preparation. Background technique [0002] During the semiconductor thin film deposition process, the wafer needs to be placed on the wafer carrier in the reaction chamber by the robot arm to perform the thin film deposition process. In the prior art, there are multiple wafers carried on the wafer tray device, and in the process of film deposition, due to various factors, the heating of the wafers during the reaction process is uneven, which affects the uniformity of film formation. This in turn affects the thickness of the wafer edge film. Generally, conventional technologies need to rely on process recipes to adjust the thickness of the film at the edge of the wafer. However, this method is relatively difficult. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/68771H01L21/68764
Inventor 张亚新戚艳丽吴凤丽叶五毛
Owner PIOTECH CO LTD
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