Solder paste stirring device with solder ball protection structure

Abstract

The invention belongs to the technical field of solder paste preparation, and particularly relates to a solder paste stirring device with a solder ball protection structure. The solder paste stirring device comprises a shell, a protection shell and a first power supply, a hydraulic push rod is fixed below the shell, support legs are connected below the hydraulic push rod, universal wheels are arranged on the right side of the hydraulic push rod, a motor is installed in the protection shell, a transmission shaft is arranged on the left side of the upper portion of the first power source, an inner shell is connected to the upper portion of the transmission shaft, a heat insulation layer is arranged on the surface of the bottom end of the inner shell, a second power source is arranged on the heat insulation layer, an electric heating wire is connected to the right side of the second power source, and a temperature sensor is arranged above the electric heating wire. The solder paste stirring device with the solder ball protection structure is convenient to move, little time and energy are consumed during moving, temperature control can be conducted on the interior during stirring, soldering tin solidification caused by the fact that the internal temperature is too low is avoided, use is convenient, disassembly and assembly are convenient, and little time and energy are consumed during discharging.

Description

technical field [0001] The invention relates to the technical field of solder paste preparation, in particular to a solder paste stirring device with a solder ball protection structure. Background technique [0002] Solder paste is also called solder paste, gray paste, and solder paste is a new type of soldering material that emerged with SMT. It is formed by mixing solder powder, flux, and other surfactants and thixotropic agents. The paste mixture is mainly used for the soldering of electronic components such as PCB surface resistance, capacitors, and ICs in the SMT industry. A special stirring device is required for the preparation of solder paste. [0003] The current traditional stirring device is not easy to move, and it takes a lot of time and energy to move. It is easy to cause the solder to solidify due to the low internal temperature during stirring, which is inconvenient to use and inconvenient to disassemble and assemble, resulting in discharge It takes a lot of...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a solder paste stirring device with a solder ball protection structure to solve the problem that similar products proposed in the background technology are not easy to move, and it takes a lot of time and energy to move, and it is easy to cause internal problems when stirring. If the temperature is too low to cause the solder to solidify, it is inconvenient to use, and it is not easy to disassemble and assemble, which leads to the problem that it takes a lot of time and energy to discharge the material.

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