Transfer device, transfer system and transfer method

Abstract

The embodiment of the invention discloses a transfer device, a transfer system and a transfer method. The transfer device comprises a transfer substrate, an excitation part and a flexible film, and the excitation part is located between the transfer substrate and the flexible film and is used for generating a gas under the excitation of an excitation source so as to generate thrust at least in the thickness direction of the transfer substrate, so that the flexible film deforms at the position where the flexible film is subjected to thrust, the contact area between the to-be-transferred chips in a to-be-transferred chip array and the flexible film is reduced, finally, the to-be-transferred chip array is separated from the transfer device, and the large-batch transfer of the to-be-transferred chips is achieved. The arrangement of the flexible film can play a role in buffering and uniformizing stress, so that at least part of the to-be-transferred chips in the to-be-transferred chip array can be separated to the position, needing to be aligned, of the target substrate under the action of the uniform stress, and the transfer precision is improved. And due to the arrangement of the flexible film, the damage, such as corrosion to the to-be-transferred chip caused by the gas generated when the excitation part is excited, etc., can be avoided.

Description

technical field [0001] Embodiments of the present invention relate to the field of display technology, and in particular, to a transfer device, transfer system and method. Background technique [0002] At present, Micro Light Emitting Diode (Micro LED) is known as the future display technology due to its high response speed, high color gamut, high brightness, long life, etc.; Liquid Crystal Display (LCD) with mm Light-emitting diode (Mini Light Emitting Diode, MINI LED) backlight technology, quantum technology or high color rendering technology also enables it to maintain its lifespan and brightness advantages compared with Organic light-emitting diodes (OLED), while reducing its contrast ratio. , means a relative disadvantage in terms of color gamut. [0003] At present, one of the bottlenecks of mass transfer of the above technologies, the technologies currently used are mechanical punching, stamping, electrostatic, fluid assembly and so on. Due to the problems of transf...

AI Technical Summary

Problems solved by technology

Due to the problems of transfer efficiency, yield and precision, it is difficult to support the mass production and popularization of Micro LED and MINI LED technology

Images