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Wafer processing method

A processing method and wafer technology, which are applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of insufficient simplification of the processing process.

Inactive Publication Date: 2021-05-18
苏州镭明激光科技有限公司
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Problems solved by technology

[0002] Processing the entire original wafer into multiple dispersed chips requires multiple processes such as slotting and cutting, and each process involves multiple small process steps such as loading and unloading, so that As a result, the overall processing process of the wafer is not simplified enough

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Embodiment Construction

[0057] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0058] In related technologies, processing the entire original wafer into multiple dispersed chips requires multiple processes such as slotting and cutting, and each process involves multiple small processes such as loading and unloading. Process steps, resulting in an insufficient simplification of the overall wafer processing process. Therefore, how to simplify the wafer processing process has become an urgent problem to be solved.

[0059] In order to solve the above technical problems, please refer to Figure 1-Figure 10 As shown, the first aspect of the present appl...

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Abstract

The invention discloses a wafer processing method, and the method comprises the following steps: carrying out the laser grooving processing of the front surface of a wafer which is not pasted with a film, carrying out the thinning processing of the back surface of the wafer, carrying out the laser modification cutting processing of the back surface of the wafer, carrying out the pasting cutting adhesive tape processing of the back surface of the wafer; processing the wafer according to the cutting adhesive tape so as to separate the wafer into a plurality of chips; and carrying out laser grooving treatment on the front surface of the wafer without the film. Compared with the prior art, for the process that laser grooving processing is carried out on the front face of the wafer with the film pasted, the process step that an iron ring is installed on the wafer before laser grooving processing is carried out on the front face of the wafer is omitted, therefore, the effects of simplifying the wafer processing technological process and improving the production efficiency are achieved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, in particular to a wafer processing method. Background technique [0002] Processing the entire original wafer into multiple dispersed chips requires multiple processes such as slotting and cutting, and each process involves multiple small process steps such as loading and unloading, so that As a result, the overall processing process of the wafer is not simplified enough. Therefore, how to simplify the wafer processing process has become an urgent problem to be solved. Contents of the invention [0003] The embodiment of the present application provides a wafer processing method, which can effectively simplify the wafer processing process to improve production efficiency. [0004] In the first aspect, the embodiment of the present application provides a wafer processing method; the method includes: [0005] Laser grooving on the front side of the uncoated wafer; ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/683
CPCH01L21/78H01L21/6836H01L2221/68336
Inventor 施心星
Owner 苏州镭明激光科技有限公司
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