A kind of HJT low temperature curing silver paste with dual curing performance and preparation method thereof

Abstract

The invention discloses an HJT low-temperature curing silver paste with dual curing performance and a preparation method thereof. Calculated in parts by weight, the composition of raw materials includes: 70-90 parts of main conductive silver powder, 1-10 parts of auxiliary conductive silver powder, acrylate 1-10 parts of resin-like resin, 1-10 parts of epoxy resin, 1-5 parts of solvent, 0.1-1 part of initiator and 0.1-2 part of curing agent; the main conductive silver powder is micron-sized silver powder; the auxiliary conductive silver powder It is nano-scale silver powder, and the silver electrode formed after curing has good conductivity and adhesion. The invention also provides a preparation method of the HJT low-temperature curing silver paste with dual curing properties, which is simple and effective in process and has a better manufacturing cost advantage.

Description

technical field [0001] The invention relates to the technical field of solar cell materials, in particular to an HJT low-temperature curing silver paste with dual curing properties and a preparation method thereof. Background technique [0002] The HJT solar photovoltaic cell is a new type of solar cell based on thin silicon substrate, and its photoelectric conversion efficiency has reached a record of about 25%, which is much higher than that of traditional crystalline silicon solar cells, and has a good market prospect. [0003] The production process of the metal silver electrode of the heterojunction HJT solar photovoltaic cell is to cure the HJT low-temperature curing silver paste on the top layer on both sides of the cell by screen printing or electroplating technology, and the structure of the silver electrode has symmetry. When the curing temperature exceeds 250°C, it is easy to destroy the internal battery structure. Therefore, the curing temperature of the HJT low-...

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Problems solved by technology

[0004] The HJT low-temperature curing silver paste of the prior art contains silver powder particles and between silver powder particles and the substrate are cured and bonded by epoxy resin or acrylic resin. When the resin content is high, the adhesion of the silver electrode is relatively good but the resistivity will be lower. High; when the resin content is low, the resistivity is low but the adhesion effect becomes poor

[0005] Therefore, the HJT low-temperature curing silver paste of the prior art has the defect that the adhesion and resistivity of the silver electrode conductive film are difficult to balance

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