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Wafer back edge film removing device

A back and edge technology, applied in the field of equipment for removing the edge film on the back of the wafer, can solve the problems of unclean edge cleaning, edge ring defects, weak edge cleaning effect, etc., to prevent unclean cleaning and scraping, and increase scraping. force, the effect of increasing the angle of inclination

Inactive Publication Date: 2021-05-25
黄嘉华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The expansion of the wafer size causes the area of ​​the edge of the wafer to expand, and it is necessary to control the edge defects. After the film on the edge of the wafer is deposited to a certain extent, it will peel off under the action of internal stress or external force. The solution is sprayed on the back and the edge. The function of rotation scrapes and cleans the edge. Since the reaction contact angle at the edge of the wafer is larger, a thicker film will be deposited along the corner of the edge, while the thickness of the film in other areas is thinner than that at the edge along the corner. During rotary scraping and cleaning, using a single inclination angle will easily cause weak cleaning effect on the upper or lower edge of the edge, resulting in unclean edge cleaning and edge ring defects.

Method used

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  • Wafer back edge film removing device
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  • Wafer back edge film removing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] like Figure 1-Figure 5 Shown:

[0024] The present invention is a device for removing the edge film on the back of the wafer. Its structure includes a film removal mechanism 1, an adjustment handle 2, a controller 3, and a closer 4. The adjustment handle 2 runs through the side of the film removal mechanism 1, and the closure The device 4 is installed on the upper end of the film removal mechanism 1, and the controller 3 is embedded in the upper left side of the film removal mechanism 1. The film removal mechanism 1 is provided with a circuit device 11, a placement mechanism 12, an operation box 13, and a rotation mechanism 14. The circuit device 11 is engaged inside the left side of the operation box 13, the placement mechanism 12 is embedded in the bottom end of the operation box 13, the outer side of the rotation mechanism 14 is welded to the inner side of the operation box 13, and the closer 4 is installed On the upper end of the operation box 13, the circuit devi...

Embodiment 2

[0031] like Figure 6-Figure 7 Shown:

[0032]Wherein, the rotating mechanism 14 is composed of a friction mechanism w1, a connecting block w2, an elastic rod w3, a fixed rod w4, a telescopic rod w5, and a rotating shaft w6. The friction mechanism w1 is embedded on the left side of the connecting block w2, and the connection The block w2 is installed on the left side of the elastic rod w3. The elastic rod w3 is located inside the fixed rod w4. The fixed rod w4 is connected to the left side of the telescopic rod w5. The outer side of the shaft w6 is welded to the inner side of the operation box 13, the outer side of the telescopic rod w5 is provided with a wrinkle ring, the fixed rod w4 and the telescopic rod w5 are installed in a horizontal state, and there is a gap between the right side of the connecting block w2 and the left side of the fixed rod w4 Cooperate, control the rotation axis w6 to rotate slightly, and at the same time, the telescopic rod w5 drives the fixed rod ...

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PUM

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Abstract

The invention discloses a wafer back edge film removing device which structurally comprises a film removing mechanism, an adjusting handle, a controller and a closer, the adjusting handle penetrates through the interior of the side face of the film removing mechanism, the closer is installed at the upper end of the film removing mechanism, and the controller is fixedly embedded in the upper end of the left side of the film removing mechanism. A lever plate performs lever movement through a supporting ring at the lower end of a movable groove, and a telescopic rod regularly ascends and descends, so that a wafer on a fixed disc obliquely moves up and down, the inclination angle for removing a film is increased, the problem that the edge cleaning and scraping effect is poor easily due to the single inclination angle is solved, and the situation that the edge of the wafer is not cleaned and scraped thoroughly, and the cleaning efficiency is improved is prevented. The friction block on the left side of the rubber plate removes the film, the friction block exerts vertical acting force when the wafer inclines, the arc-shaped structure of the rubber plate prevents the middle from being sunken in the scraping process, the stress of the arc-shaped structure of the rubber plate on the edge corner position of the wafer is good, and the situation that the edge corner position of the wafer is cleaned and scraped uncleanly is prevented.

Description

technical field [0001] The invention relates to the field of wafer coating, in particular to a device for removing the edge film on the back of the wafer. Background technique [0002] The expansion of the wafer size causes the area of ​​the edge of the wafer to expand, and it is necessary to control the edge defects. After the film on the edge of the wafer is deposited to a certain extent, it will peel off under the action of internal stress or external force. The solution is sprayed on the back and the edge. The function of rotation scrapes and cleans the edge. Since the reaction contact angle at the edge of the wafer is larger, a thicker film will be deposited along the corner of the edge, while the thickness of the film in other areas is thinner than that at the edge along the corner. During rotary scraping and cleaning, using a single inclination angle will easily result in weak cleaning effect at the upper or lower end of the edge, resulting in unclean edge cleaning an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67H01L21/02
CPCH01L21/02087H01L21/02096H01L21/67092H01L21/68764
Inventor 黄嘉华
Owner 黄嘉华