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A spray module and cleaning agent recovery system

A recovery system and cleaning agent technology, which is applied in the field of injection module and cleaning agent recovery system, can solve the problems of high production cost and low cleaning agent recovery rate, and achieve the effect of improving recovery rate and reducing production cost

Active Publication Date: 2022-06-24
PNC PROCESS SYSTEMS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a spray module and cleaning agent recovery system, aiming to solve the technical problems of low cleaning agent recovery rate and high production cost in the prior art

Method used

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  • A spray module and cleaning agent recovery system
  • A spray module and cleaning agent recovery system
  • A spray module and cleaning agent recovery system

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Embodiment Construction

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work, all belong to the protection scope of the present invention.

[0035] It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other under the condition of no conflict.

[0036] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0037] see Figure 1-2 , a spray module for cleaning the surface of a wafer (10...

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Abstract

The present invention provides a spray module and a cleaning agent recovery system. On the one hand, the spray module includes a first input pipeline for inputting a first cleaning agent; the first input pipeline communicates with a return pipeline; the first cleaning agent is Input to the return pipeline for recovery prior to injection. On the other hand, the recovery member and the recovery treatment module located in the cavity of the cleaning module process the sprayed waste liquid and extract the first cleaning agent for recovery. By recovering the cleaning agent before spraying and recycling the waste liquid after cleaning the wafer, the recovery rate of the cleaning agent is effectively improved and the production cost is reduced.

Description

technical field [0001] The present invention relates to the technical field of wafer manufacturing, in particular to a spray module and a cleaning agent recovery system. Background technique [0002] Wafer refers to the wafer used in the manufacture of silicon semiconductor circuits. Wafer cleaning is a process of removing contaminants caused by contact with various organic substances, particles and metals during the continuous processing and polishing of wafers. It is an important process step in the wafer fabrication process. [0003] In the semiconductor cleaning process, especially for high-end wafer products such as logic integrated circuits, storage, power devices and other related wafer products, in the manufacturing process, various lithography, wet, deposition, oxidation and other related processes are carried out. Processing, the process of cleaning the substrate is performed before or after each process to remove foreign matter and particles generated in each pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/02B08B3/08B08B13/00H01L21/67
CPCB08B3/02B08B3/08B08B13/00H01L21/67051B08B2203/0217
Inventor 邓信甫国天增刘大威陈丁堃
Owner PNC PROCESS SYSTEMS CO LTD