Transfer process and transfer equipment for LED lamp beads

Abstract

The invention discloses a transfer process and transfer equipment for LED lamp beads. The transfer process of the LED lamp beads comprises the following steps that a) the LED lamp beads and a material carrying film are provided, and the multiple LED lamp beads are arranged on the bottom face of the material carrying film; the material carrying film bottom layer is an adhesive layer; the top surfaces of the LED lamp beads are light-emitting surfaces, and pins are arranged on the bottom surfaces of the LED lamp beads; and the light emitting surfaces are adhered to the adhesive layer; b) a driving back plate is provided, a plurality of patch areas are arranged on the top surface of the driving back plate; a bonding pad is arranged in the patch area, and solder paste is arranged on the bonding pad; c) at least one LED lamp bead is selected as a target LED lamp bead, and at least one patch area is selected as a target patch area; and the target LED lamp bead is moved to a position right above the target chip mounting area; and d) the target LED lamp bead is released to the target patch area, and the target LED lamp bead is stripped from the material carrying film. According to the invention, the transfer efficiency is high, the transfer precision is high, and the production difficulty is low; and LED display modules with different dot intervals can be produced.

Description

technical field [0001] The invention relates to the technical field of LED display screens, in particular to a transfer process and transfer equipment for LED lamp beads. Background technique [0002] The light-emitting surface of the LED display is spliced ​​by multiple display modules. The display module includes a driver backplane and a plurality of LED lamp beads mounted on the surface of the driver backplane. [0003] In the prior art, the LED lamp bead is mounted on the surface of the driver backplane through an SMT process (Surface Mounted Technology, surface mount technology). In the SMT process, the placement machine accurately places the LED lamp beads on the pads of the driving backplane by moving the placement head. [0004] However, as people's pursuit of display effects continues to improve, the dot pitch of LED displays is getting smaller and smaller, such as P0. , the resolution of the LED display is getting higher and higher, such as 4K / 8K, [0005] In t...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved in the present invention is to propose a transfer process and transfer equipment for LED lamp beads based on the deficiencies of the above-mentioned prior art, which solves the problem of low transfer efficiency, low transfer accuracy and inability to meet the needs of product diversification in the existing SMT process The problem

Images