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Heat-conducting resin composition and preparation method thereof

A heat-conducting resin and composition technology, applied in the field of potting glue, can solve the problems of thermal conductivity, insulation, manufacturability and practical balance, and achieve the effect of increasing the content of heat-conducting fillers

Active Publication Date: 2021-06-01
ZHEJIANG RONGTAI TECH ENTERPRISE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that it is difficult to achieve a balance between thermal conductivity, insulation, manufacturability and practicability in the prior art, a thermal conductive resin composition and a preparation method thereof are provided

Method used

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  • Heat-conducting resin composition and preparation method thereof

Examples

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Effect test

Embodiment 1

[0043]A thermally conductive resin composition is prepared from the following raw materials: 11 grams of component A, 100 grams of component B and an appropriate amount of component C.

[0044] The preparation of component A is: after mixing 99.5 grams of PM200 and 0.5 grams of BYK-066N, vacuum defoaming at 60°C for 30 minutes, and then lowering to 25°C.

[0045] The preparation of component B is as follows: disperse 29 grams of castor oil, 0.3 grams of BYK-066N, 0.2 grams of BYK-9076, 0.5 grams of fumed silica, and 70 grams of M50D alumina at high speed for 20 minutes, and vacuum dehydrate at 120 ° C for 2 hours. to room temperature, prepared.

[0046] The preparation of component C is as follows: drying spherical alumina with a diameter of 3.0 mm at 110 ° C for 5 hours, and then cooling it down to room temperature under nitrogen protection.

[0047] A preparation method of a heat-conducting resin composition is as follows: manually stir 11 grams of component A and 100 grams...

Embodiment 2

[0049] The thermal resin composition is prepared from the following raw materials: 7.5 grams of component A, 100 grams of component B and 150 grams of component C.

[0050] The preparation of component A is: after mixing 99.5 grams of PM200 and 0.5 grams of BYK-066N, vacuum defoaming at 60°C for 30 minutes, and then lowering to 25°C.

[0051] The preparation of component B is: 19 grams of castor oil, 0.3 grams of BYK-066N, 0.2 grams of KH-560 (γ-(2,3-glycidyloxy) propyltrimethoxysilane), 0.5 grams of gas phase dioxide Silicon and 80g of M50D alumina were dispersed at high speed for 20 minutes, vacuum dehydrated at 120°C for 2 hours, and cooled to room temperature to prepare component B.

[0052] The preparation of component C is as follows: drying spherical alumina with a diameter of 1.5mm at 110°C for 5 hours, and cooling down to room temperature under nitrogen protection to become component C.

[0053] A preparation method of a thermally conductive resin composition is as f...

Embodiment 3

[0055] A thermally conductive resin composition prepared from the following raw materials: 6 grams of component A, 100 grams of component B and 100 grams of component C.

[0056] The preparation of component A is: after mixing 99.5 grams of PM200 and 0.5 grams of BYK-066N, vacuum defoaming at 60°C for 30 minutes, and then lowering to 25°C.

[0057] The preparation of component B is as follows: disperse 14 grams of castor oil, 0.3 grams of BYK-066N, 0.2 grams of KH-560, 0.5 grams of fumed silica, and 85 grams of M50D alumina at high speed for 20 minutes, and vacuum dehydrate at 120 ° C for 2 hours. To room temperature, made into component B.

[0058] The preparation of component C is as follows: drying spherical alumina with a diameter of 0.8mm at 110°C for 5 hours, and cooling it down to room temperature under nitrogen protection to become component C.

[0059] A preparation method of a heat-conducting resin composition is as follows: 6 grams of component A and 100 grams of c...

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Abstract

The invention relates to the technical field of pouring sealants, in particular to a heat-conducting resin composition and a preparation method thereof. The heat-conducting resin composition is prepared from the following raw materials: a component A, a component B and a component C, the ratio of the molar weight of the isocyanate group contained in the component A to the molar weight of the hydroxyl contained in the component B is (1.0-0.9): (1.0-0.9); and the weight of the component C is 50-300% of the weight of the component B. The heat-conducting resin composition has the advantages of thermal conductivity, insulativity, manufacturability and practicability. The preparation method comprises the following steps: preparing the component A, preparing the component B, preparing the component C, stirring and mixing the component A and the component B, fully mixing the component C and a mixture of the component A and the component B, carrying out vacuum defoaming, injecting the mixture into a mold, and carrying out curing molding to obtain a finished product. According to the preparation method, a three-component composition and a secondary mixing process are adopted, the content of the heat-conducting filler is effectively increased under the condition that a solvent is not used, meanwhile, the contradiction that the viscosity is too high and cannot be operated due to the fact that the content of the filler is high is solved, and the high-heat-conductivity material is obtained.

Description

technical field [0001] The present application relates to the technical field of potting glue, in particular to a thermally conductive resin composition and a preparation method thereof. Background technique [0002] With the development of the electronic information industry, the application of electronic products is becoming more and more extensive, and the problem of heat generation during the use of electronic products is becoming more and more serious. Poor heat dissipation leads to product performance degradation and shortened life span. Due to the low thermal conductivity of air, it is only about 0.02W / mk. In order to solve the problem of heat dissipation, at present, the usual method is to use materials with good thermal conductivity to fill the air instead, so that the heat generated during the operation of electronic products can be dissipated smoothly. [0003] Polymer resin has good fluidity, can be cured, and is easy to use, and has been widely used in various ...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J11/04
CPCC09J175/14C09J11/04C08K2003/2227C08K2201/003C08K3/36C08K3/22C08K7/18
Inventor 郑敏敏王宝湖沈彬马苗葛凡
Owner ZHEJIANG RONGTAI TECH ENTERPRISE