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A kind of boron-doped graphene reinforced copper-based composite material and preparation method thereof

A copper-based composite material and a composite material technology are applied in the field of boron-doped graphene reinforced copper-based composite materials and their preparation, which can solve problems such as the decrease of electrical conductivity, improve mechanical strength and electrical conductivity, realize tight connection, increase Combining the effects of the interface

Active Publication Date: 2022-03-04
AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] To sum up, the current composite methods all have shortcomings. Most of the methods can effectively improve the mechanical strength of copper-based composite materials, but will cause a decrease in electrical conductivity.

Method used

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  • A kind of boron-doped graphene reinforced copper-based composite material and preparation method thereof
  • A kind of boron-doped graphene reinforced copper-based composite material and preparation method thereof
  • A kind of boron-doped graphene reinforced copper-based composite material and preparation method thereof

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Embodiment 1

[0041] In this embodiment, the boron-doped graphene-reinforced copper-based composite material includes a copper substrate and boron-doped graphene uniformly distributed in the copper substrate. The boron-doped graphene is doped with boron on the graphene sheet, and Cu-B-C bonds are formed between the graphene and the copper substrate.

[0042] The preparation method of boron-doped graphene reinforced copper-based composite material in the present embodiment ( figure 1 shown), the steps are as follows:

[0043] (1) Preparation of boron-doped graphene

[0044] Boric acid is dissolved in ethanol, then add graphene and mix, obtain graphene / boric acid mixed solution, the mass ratio of described boric acid and graphene is 1:1, and graphene sheet size is 30-50 μ m, sheet layer 2- 3 floors;

[0045] Filter the graphene / boric acid mixed solution to obtain a solid mixture; place the solid mixture in a hydrogen-argon gas mixture, wherein hydrogen accounts for 5 vol%, raise the temper...

Embodiment 2

[0051] In this embodiment, the boron-doped graphene-reinforced copper-based composite material includes a copper substrate and boron-doped graphene uniformly distributed in the copper substrate. The boron-doped graphene is doped with boron on the graphene sheet, and Cu-B-C bonds are formed between the graphene and the copper substrate.

[0052] The preparation method of boron-doped graphene reinforced copper-based composite material in the present embodiment, the steps are as follows:

[0053] (1) Preparation of boron-doped graphene

[0054] Boric acid is dissolved in ethanol, then add graphene and mix, obtain graphene / boric acid mixed solution, the mass ratio of described boric acid and graphene is 3:1, and graphene sheet size is 30-50 μ m, sheet layer 2- 3 floors;

[0055] Filter the graphene / boric acid mixture to obtain a solid mixture; place the solid mixture in a hydrogen-argon gas mixture, wherein hydrogen accounts for 5 vol%, raise the temperature to 1000° C. and keep...

Embodiment 3

[0061] In this embodiment, the boron-doped graphene-reinforced copper-based composite material includes a copper substrate and boron-doped graphene uniformly distributed in the copper substrate. The boron-doped graphene is doped with boron on the graphene sheet, and Cu-B-C bonds are formed between the graphene and the copper substrate.

[0062] The preparation method of boron-doped graphene reinforced copper-based composite material in the present embodiment, the steps are as follows:

[0063] (1) Preparation of boron-doped graphene

[0064] Boric acid is dissolved in ethanol, then add graphene and mix, obtain graphene / boric acid mixed solution, the mass ratio of described boric acid and graphene is 5:1, and graphene sheet size is 30-50 μ m, sheet layer 2- 3 floors;

[0065] Filter the graphene / boric acid mixture to obtain a solid mixture; place the solid mixture in a hydrogen-argon gas mixture, wherein hydrogen accounts for 5 vol%, raise the temperature to 1100°C and keep i...

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Abstract

The invention relates to the technical field of metal-based composite materials, and specifically discloses a boron-doped graphene-reinforced copper-based composite material and a preparation method thereof. The copper-based composite material of the present invention uses boron-doped graphene as a reinforcing body, effectively increases the bonding interface between copper and graphene, and improves the electron transmission at the interface. Among them, boron-doped graphene is boron-doped on the complete graphene sheet, which basically does not destroy the structural integrity of graphene. The electron transport performance of graphene after boron doping is better, and Cu-B-C bonds can be formed between graphene and copper substrate, taking into account interface bonding and electron transport. The invention combines graphene doping, copper raw material and reinforcement mixing, heat treatment and other processes to successfully prepare a copper-based composite material with uniform distribution of boron-doped graphene. Experiments have proved that the tensile strength of the boron-doped graphene-reinforced copper matrix composite is not lower than 308.6 MPa, and the electrical conductivity is not lower than 90.6% IACS.

Description

technical field [0001] The invention relates to the technical field of metal-based composite materials, in particular to a boron-doped graphene-reinforced copper-based composite material and a preparation method thereof. Background technique [0002] Copper and copper alloys have the characteristics of electrical conductivity, thermal conductivity, corrosion resistance, and good plasticity. They are important basic materials for national economic construction and are widely used in many fields such as electronic information and aerospace. With the development of material science and modern industry, higher requirements are placed on the properties of copper, and copper-based composites are likely to meet these requirements. In copper-based composite materials, the improvement of mechanical strength and the improvement of electrical conductivity are a pair of prominent contradictions, and it is difficult to improve them synergistically. [0003] At present, there are mainly ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/05C22C1/10B22F3/02B22F3/14C22F1/08C22F1/02C01B32/194
CPCB22F1/0003C22C9/00C22C1/05B22F3/02B22F3/14C22F1/08C22F1/02C01B32/194
Inventor 杨名李铁军刘文祎王耀奇侯红亮
Owner AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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