Efficient vacuum electroplating device with mixed plating function

Abstract

The invention relates to an efficient vacuum electroplating device with a mixed plating function, and belongs to the field of electroplating equipment. The efficient vacuum electroplating device comprises a rack, a vacuum cover is arranged on the rack, an electroplating frame and an evaporator are arranged in the vacuum cover, a feeding device for conveying electroplating materials for the evaporator is further arranged on the rack, and the feeding device comprises a feeding pipe and a feeding mechanism; the feeding pipe is installed on the rack, the feeding mechanism comprises a screening device and a frequency controller, the screening device and the frequency controller are both installed on the rack, the frequency controller comprises a rotating disc and a driving part which is installed on the rack and used for driving the rotating disc to rotate, and a material storage hole is formed in the rotating disc and matched with the feeding pipe; and the feeding pipe extends into the evaporator. The efficient vacuum electroplating device has the effects that the entering speed of the electroplating material can be controlled, and the electroplating efficiency is improved.

Description

technical field [0001] The present application relates to the field of electroplating equipment, in particular to a high-efficiency vacuum electroplating device with mixed plating. Background technique [0002] Electroplating is to form a layer of film on the surface of the product, so that the product has higher wear resistance, strength and other properties when it is used. At present, in order to meet the requirements of safer, more energy-saving, lower noise and less pollutant discharge, vacuum electroplating has become a new trend of environmental protection in the surface treatment process. Vacuum electroplating is divided into several types: vacuum evaporation, sputtering and ion plating. Vacuum evaporation has the advantages of simple film formation method, high film purity and compactness, and unique film structure and performance. [0003] In actual production, mixed electroplating is generally carried out by evaporation method. The inventors found that in the vac...

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Problems solved by technology

[0003] In actual production, mixed electroplating is generally carried out by evaporation method. The inventors found that in the vacuum evaporation process, although instantaneous evaporation method can obtain a thin film with uniform composition , and it can do dopant evaporation, but its evaporation rate is difficult to control, so it needs to be improved

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