Chip detection method, electronic equipment and storage medium

Abstract

The invention relates to a chip detection method, electronic equipment and a storage medium. The method comprises the following steps: using a black and white high-resolution camera to shoot a rough detection image of a to-be-detected chip under a low-magnification objective lens; performing preliminary defect type analysis based on the rough detection image; using a color high-resolution camera to shoot an upper surface image and a lower surface image of the to-be-detected chip under a high-magnification objective lens; fusing the upper surface image and the lower surface image into one image by using an image fusion algorithm to obtain a recheck image with superimposed depth-of-field information; and performing defect analysis on the reinspection image by using a defect analysis algorithm, and identifying a defect type corresponding to the target defect image. According to the scheme provided by the invention, the black and white high-resolution camera can be used for completing rough inspection under the low-magnification objective lens, and the color high-resolution camera can be used for completing reinspection under the high-magnification objective lens, so that the data acquisition cost for acquiring the to-be-analyzed image in the early stage is reduced, and the efficiency of the whole defect analysis and treatment process is improved.

Description

technical field [0001] The present application relates to the technical field of chip detection, in particular to a chip detection method, electronic equipment and a storage medium. Background technique [0002] With the rapid development of various smart devices, the miniaturization of devices in smart devices has also become a major trend. Among them, the LED chips used in the screen are closely related to the resolution of the screen: when other conditions remain unchanged, the smaller the LED chip, the higher the resolution of the screen. On this basis, micron LED chips came into being. Micron LEDs are extremely small in size, generally only 20-30 microns (traditional LED chips: >1000 microns, mini LED chips: 100-200 microns). [0003] Micron LED chip is a new generation of chip, and its corresponding detection equipment is less. Now the commonly used equipment is to modify the detection equipment of mini LED chip, and simply increase the magnification of the chip b...

AI Technical Summary

Problems solved by technology

[0004] 1. The chip is only amplified once, which is equivalent to indiscriminately amplifying all defects on the chip. Considering that the characteristics of different types of defects need to be accurately identified under different magnifications, this detection method will cause The characteristics of some defects are not obvious, resulting in identification errors or failure to identify, thus affecting the over-missing rate of equipment;

[0005] 2. The high-magnification magnification of the chip makes the field of view of the captured image very limited. In the case of the same chip area, more photos need to be taken to obtain the defect image, the processing process is complicated, and the acquisition cost of obtaining and analyzing the image increases. It also increases the burden of data transmission and storage, resulting in low efficiency of defect analysis and processing, especially in the case of various and complex defects, which further reduces the efficiency of defect analysis and processing

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