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Sensor packaging structure, manufacturing method thereof and electronic equipment

A technology of packaging structure and manufacturing method, which is applied in the direction of sensors, microphones, electrostatic transducer microphones, etc., can solve the problems of easy breakage of connecting metal wires, and achieve the effects of reducing the risk of breakage, improving structural stability, and light weight

Active Publication Date: 2021-06-04
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] The main purpose of the present invention is to provide a sensor packaging structure, aiming to solve the problem of easy breakage of connecting metal wires

Method used

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  • Sensor packaging structure, manufacturing method thereof and electronic equipment
  • Sensor packaging structure, manufacturing method thereof and electronic equipment
  • Sensor packaging structure, manufacturing method thereof and electronic equipment

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0036] In the present in...

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Abstract

The invention discloses a sensor packaging structure and a manufacturing method thereof and an electronic device. The sensor packaging structure comprises a cover cap, a substrate, an ASIC chip and a sensor chip, wherein the substrate and the cover cap are enclosed to form an accommodating cavity; the ASIC chip is arranged in the accommodating cavity and is electrically connected with the substrate; and the sensor chip is arranged in the accommodating cavity and is electrically connected with the substrate through a flexible circuit board. According to the technical scheme, the sensor packaging structure can solve the problem that the metal wires are prone to breakage, and the product yield is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a sensor packaging structure, a manufacturing method thereof, and electronic equipment. Background technique [0002] At present, in order to obtain better signal conduction, in the sensor packaging structure, the substrate and the ASIC chip and the sensor chip are mostly electrically connected through metal wires. The connecting metal wire is easily subjected to external stress, which leads to cracks in the solder feet, resulting in sensor failure. Contents of the invention [0003] The main purpose of the present invention is to provide a sensor packaging structure, aiming to solve the problem that the connecting metal wires are easy to break. [0004] In order to achieve the above object, the sensor packaging structure proposed by the present invention includes: [0005] cover; [0006] a substrate, the substrate and the cover are enclosed to form an accommo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00H04R19/04
CPCH04R31/006H04R19/04H04R2201/003
Inventor 唐怀军孟凡亮于永革
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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