Near-field suspension and static pressure suction coupled suspension grabbing system

An adsorption phase and static pressure technology, applied in non-mechanical conveyors, transportation and packaging, conveyors, etc., can solve the problems of product damage, inability to maintain the stability of suspended objects, etc., and achieve safe and reliable use, low noise, The effect of simple structural design

Active Publication Date: 2021-06-08
SHANDONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional transportation method cannot realize non-contact transportation, only through single vacuum adsorption, which is easy to cause damage to the product; and the single use of ultrasonic near-field levitation technology cannot maintain the stability of the suspended objects during transportation

Method used

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  • Near-field suspension and static pressure suction coupled suspension grabbing system
  • Near-field suspension and static pressure suction coupled suspension grabbing system
  • Near-field suspension and static pressure suction coupled suspension grabbing system

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Experimental program
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Embodiment Construction

[0030] The present invention will be further explained below in conjunction with the accompanying drawings.

[0031] Such as figure 1 As shown, a suspension grasping system coupled with near-field suspension and static pressure adsorption includes an ultrasonic suspension excitation device 1 , a static pressure adsorption device 2 , a control system 3 , and a robotic arm 4 .

[0032] Such as Figure 5 to Figure 7 As shown, the ultrasonic levitation excitation device 1 includes a piezoelectric transducer, a radiation disk 1-2, a stabilized power supply 1-10, and an ultrasonic signal generator 1-11. The piezoelectric transducer includes ultrasonic horn 1-3, nodal flange 1-4, several piezoelectric ceramic sheets 1-5, several electrode sheets 1-6, insulating sleeve 1-7, rear cover 1- 8. Pre-tightening bolts 1-9. Ultrasonic horns 1-3, insulating sleeves 1-7, and rear cover plates 1-8 are arranged sequentially from top to bottom, and piezoelectric ceramic sheets 1-5 and electrode...

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Abstract

The invention discloses a near-field suspension and static pressure suction coupled suspension grabbing system. The near-field suspension and static pressure suction coupled suspension grabbing system comprises an ultrasonic suspension excitation device, a static pressure suction device, a control system and a mechanical arm, wherein the ultrasonic suspension excitation device is connected with the mechanical arm; the ultrasonic suspension excitation device comprises a piezoelectric transducer and a radiation disc, and the piezoelectric transducer is connected with the radiation disc; a plurality of air holes are evenly formed in the radiation disc, and the radiation disc serves as an suction disc of the static pressure suction device; and the control system is connected with the ultrasonic suspension excitation device and the static pressure suction device. In the moving process, static pressure generated by the static pressure suction device and suspension force generated by the ultrasonic suspension excitation device are adjusted according to different moving speeds and different postures of the piezoelectric transducer, and due to the fact that vacuum suction and high-frequency vibration extrude an air film to generate viscous force pointing to the disc center, an object is always located in the radiation disc face when the mechanical arm moves, and the stability of the suspended object in the transportation process is improved.

Description

technical field [0001] The invention relates to a suspension grabbing system, which belongs to the field of non-contact transportation. Background technique [0002] At present, in industries such as wafers and precision optical devices, the requirements for the surface quality of products are relatively high. Taking semiconductor wafers as an example, it is required that there should be no scratches on the surface during the production process of the wafer. The surface scratches of the wafer during the production process Injury is also one of the reasons for the yield rate in the production of semiconductor wafers. At present, the transportation method of wafers is mainly contact vacuum adsorption. Countries and related companies are also constantly developing and improving wafer processing technology and equipment. Wafer transportation is an important link in production, and reducing damage to wafers in the process of grabbing and transportation plays an important role in ...

Claims

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Application Information

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IPC IPC(8): B65G54/02
CPCB65G54/02
Inventor 李贺李渊博沈毅王禹孙伟周宇地
Owner SHANDONG UNIV OF SCI & TECH
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