Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic equipment

A technology of electronic equipment and equipment, applied in branch office equipment, telephone communication, electrical components, etc., can solve the problems of increasing the difficulty of stress arrangement on the main board, stress mismatch, etc., to reduce electromagnetic interference, reduce the difficulty of board layout, and increase the layout area effect

Active Publication Date: 2021-06-08
VIVO MOBILE COMM CO LTD
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 3. The SIM card bracket is made of metal material and connected to the main board. The thermal expansion coefficient of the metal material and the resin on the main board is different, and there will be a stress mismatch problem, which increases the difficulty of stress arrangement on the main board.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic equipment
  • Electronic equipment
  • Electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Embodiments of the present invention will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0029] The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses electronic equipment which comprises: an equipment body, wherein a first main board and a second main board are oppositely arranged in the equipment body, the first main board and the second main board are spaced to form a containing cavity, one of the opposite surfaces of the first main board and the second main board is provided with a function connecting part, and the other one is provided with a limiting part; and a functional assembly, wherein the functional assembly is detachably arranged in the containing cavity, and under the condition that the functional assembly is located in the containing cavity, the functional connecting part abuts against the first side of the functional assembly, and the limiting part abuts against the second side of the functional assembly. The first mainboard and the second mainboard are provided with the function connecting part and the limiting part, the function assembly is directly connected into the containing cavity formed by the mainboards, a support used for fixing the function assembly does not need to be additionally arranged on the mainboards, electromagnetic interference of the support to other devices on the mainboards is reduced, and meanwhile, the problem of stress mismatching caused by different thermal expansion coefficients of a bracket material and a main board material is solved.

Description

technical field [0001] The present application belongs to the technical field of electronic product manufacturing, and in particular relates to an electronic device. Background technique [0002] With the development of mobile terminals and wearable electronic products, many new functions and new devices are added, which brings more and more challenges to the motherboard layout of electronic products. Consumers are using these products more and more frequently, and their requirements for portability are also getting higher and higher. In order to solve this problem, many companies began to develop in the direction of the Z axis, and the process of sandwich stacking began to appear. However, some peripheral access functions require a separate layout space on the motherboard, such as SIM (full name: Subscriber Identity Module International Mobile Subscriber Identity Module) card, and the SIM card is connected to the electronic device (or called the main body of the device) ,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02
CPCH04M1/0274
Inventor 蔡光骏
Owner VIVO MOBILE COMM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com