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LED light-emitting module packaging method and device

A light-emitting module and packaging method technology, which is applied in the direction of printed circuits, electrical components, circuits, etc. connected to non-printed electrical components, can solve problems such as defective air bubbles, reduce defective air bubbles, save pre-curing steps, and improve Effect of Packaging Equipment Utilization and Production Efficiency

Active Publication Date: 2021-06-11
深圳博元新材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the embodiments of the present invention is that the existing packaging method with the LED display facing down is prone to the problem of bad air bubbles

Method used

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  • LED light-emitting module packaging method and device
  • LED light-emitting module packaging method and device
  • LED light-emitting module packaging method and device

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Embodiment Construction

[0055] The following descriptions of various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented. In the present invention, LED light-emitting modules include but are not limited to products formed by surface mounting, welding, and semi-embedding of light-emitting diodes (LEDs) and their lamp beads on hard or flexible PCB substrates; the applications of the modules include but are not limited to Limited to lighting, backlight and display.

[0056] Please refer to Figure 4 As shown, Embodiment 1 of the present invention provides a LED lighting module packaging method, including steps S1-S5.

[0057] Step S1, in the bonding environment, place the LED lighting module 1 in the jig 3 with the display facing up;

[0058] Step S2, applying glue 2 to the LED lighting module 1, and vacuuming the bonding environment;

[0059] Step S3, covering the glue 2 with a microporous release film 4, so that an adhe...

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Abstract

The invention discloses an LED light-emitting module packaging method and device. The LED light-emitting module packaging method comprises the steps of: placing a module in a jig in a manner that a display surface faces upwards in an attaching environment; applying glue to the module, and vacuumizing the attaching environment; covering a microporous release film on the glue, so that a glue layer with a preset thickness is formed between the microporous release film and a PCB of the module, wherein micropores of the micropore release film are used for exhausting, and the pore diameter meets the requirement for preventing glue from overflowing; curing the adhesive layer; and stripping the microporous release film to obtain a packaged LED light-emitting module finished product. The method does not need preheating, can reduce volatilization of organic components in the glue, and reduces bad bubbles. In addition, even if a small amount of bubbles exist in the packaging glue, the bubbles can be discharged through micropores in the micropore release film in the gluing process, and a compact protection structure is formed in the packaging glue or between the packaging glue and a substrate, a device or electrical connection. As a pre-curing step can be omitted, the utilization rate of packaging equipment can be improved.

Description

technical field [0001] The invention belongs to the technical field of LED light-emitting modules, and in particular relates to an LED light-emitting module packaging method and equipment. Background technique [0002] LED light-emitting modules are widely used, including: light-emitting diode (LED) display screens and backlight devices. [0003] Take mini-LED display technology as an example, such as Figure 1a (front view), 1b (rear view), and 1c (side view), the LED lighting module 1 is composed of an array of LEDs (light-emitting chips or lamp beads) 11 electrically connected to a PCB board 12, and the back side of the PCB board 12 The electronic components 13 for driving the LED 11 are welded, and several support columns 14 are usually arranged on the back thereof, as support and stress points in the manufacturing process or fixed force application points for the module product in terminal use, and the height of the support columns 14 is usually higher than Electronic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/16H01L33/48H05K1/18H05K3/28
CPCH01L25/50H01L25/167H01L33/48H05K1/185H05K3/284
Inventor 陈文明黄卓鸿
Owner 深圳博元新材科技有限公司