Cabin plate integrally formed based on 3D printing

Abstract

The invention discloses a cabin plate integrally formed based on 3D printing, and relates to the technical field of aerospace. The cabin plate is integrally printed and formed by a 3D printer, a truss channel heat pipe is printed in the cabin plate, and an internal channel is printed in the truss channel heat pipe; a dot matrix structure is printed outside the cabin plate, and a mounting interface for mounting electronic equipment is printed on the dot matrix structure; and the internal channel is used for allowing a heat exchange working medium to flow so that the heat exchange working medium exchanges heat with the electronic equipment. The cabin plate is suitable for load heat dissipation of a space satellite, the situation that in the prior art, a honeycomb core in the cabin plate is damaged through pre-buried heat pipes is avoided, and therefore the cabin plate has better bearing capacity and mechanical resistance, and the purpose of light weight is achieved. In addition, the purposes of heat dissipation and temperature equalization of a plurality of heat sources in all directions can be achieved, the problems of local thermal resistance or heat pipe drying and failure caused by non-connection of the channels are reduced, and the heat dissipation efficiency and the temperature control precision are improved.

Description

technical field [0001] The invention relates to the field of aerospace technology, in particular to an integrally formed deck based on 3D printing. Background technique [0002] At present, with the continuous development of aerospace technology, the integration of satellites is getting higher and higher. With the increase of high-power, high-heat-flux payloads, and the research and development of high-heating, high-precision equipment, the cooling capacity and structural stability of satellite platforms are affected. Sexuality puts forward higher demands. [0003] Existing satellite platforms generally use pre-embedded heat pipes in the sandwich layer of the honeycomb sandwich composite material structure. The honeycomb sandwich is used to bear mechanical loads, while the distributed heat pipes are used for passive heat transfer to achieve heat transfer in multiple directions. , or to achieve temperature uniformity between electronic devices in multiple directions. Howeve...

AI Technical Summary

Problems solved by technology

However, the way of pre-embedding heat pipes will destroy the integrity of the honeycomb sandwich structure, resulting in a reduction in its load-carrying capacity. Moreover, there are multiple layers of lap thermal resistance at the orthogonal laps of the heat pipes, and the contact thermal resistance is very large, resulting in poor heat dissipation efficiency. and poor temperature control accuracy

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