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Sensor integrated with signal processing circuit and preparation method of sensor

A signal processing circuit and sensor technology, applied in the field of sensors, to improve the overall performance and improve the signal-to-noise ratio

Active Publication Date: 2021-06-15
SHANGHAI JIAO TONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a sensor with an integrated signal processing circuit and a preparation method thereof, which are used to solve the problems in the integration cost, large-area preparation, material and process selectivity and compatibility of circuits and sensors in the prior art

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  • Sensor integrated with signal processing circuit and preparation method of sensor
  • Sensor integrated with signal processing circuit and preparation method of sensor

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preparation example Construction

[0062] Not only that, but this specific embodiment also provides a method for preparing a sensor integrated with a signal processing circuit as described above. attached figure 2 It is a flow chart of the preparation method of the sensor of the integrated signal processing circuit in the specific embodiment of the present invention, with image 3 It is a schematic diagram of the manufacturing process of the sensor with integrated signal processing circuit in the specific embodiment of the present invention. The structure of the sensor of the integrated signal processing circuit prepared in this specific embodiment can be found in Figure 1A and Figure 1B . Such as Figure 1A , Figure 1B , figure 2 and image 3 As shown, the preparation method of the sensor with integrated signal processing circuit provided in this specific embodiment includes the following steps:

[0063] In step S21 , a first substrate 10 is provided, and an arrayed sensitive element 11 is formed on...

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Abstract

The invention belongs to the technical field of sensors and relates to a sensor integrated with a signal processing circuit and a preparation method of the sensor. The sensor integrated with the signal processing circuit comprises a first substrate, a second substrate, a bonding layer and an interconnection line;the upper surface of the first substrate is provided with a sensitive element; the upper surface of the second substrate is provided with the signal processing circuit constructed by a thin film transistor; the bonding layer is positioned between the first substrate and the second substrate and is used for bonding the lower surface of the first substrate and the upper surface of the second substrate or bonding the lower surface of the first substrate and the lower surface of the second substrate; and the interconnection line at least penetrates through the first substrate and the bonding layer and is used for electrically connecting the sensitive element and the signal processing circuit. According to the sensor integrated with the signal processing circuit and the preparation method of the sensor of the invention, the technology compatibility problem is solved, the integration level and the signal-to-noise ratio are improved, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a sensor with an integrated signal processing circuit and a preparation method thereof. Background technique [0002] At present, for the sensing and detection of weak signals such as bioelectrical signals, it is necessary to integrate a transistor-based signal amplification and processing circuit at the front end of the sensor to reduce the performance requirements for the back-end reading system and improve the signal-to-noise ratio and detection limit etc. [0003] The existing integration schemes between sensors and transistor-based circuits mainly include hybrid integration and monolithic integration. Hybrid integration realizes the integration of sensors and transistor-based circuits by transferring and attaching transistor-based circuits and sensors to an adapter board with metal wiring. After integration, transistor-based circuit modules need to be packaged separately, s...

Claims

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Application Information

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IPC IPC(8): G01R31/00
CPCG01R31/00
Inventor 郭小军韩磊陈苏杰唐伟
Owner SHANGHAI JIAO TONG UNIV
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