Semiconductor device trimming device

Abstract

The invention discloses a semiconductor device trimming device which comprises a bottom die, a pressing die, a material pushing mechanism and a material distributing mechanism. The pressing die is arranged above the bottom die, a rectangular through hole and a bending cavity are formed between the bottom die and the pressing die, the bending cavity is communicated with the rectangular through hole, and the bending cavity is used for shaping and cutting off pins of semiconductors. The bottom die is provided with a feeding groove and a discharging groove. The material pushing mechanism comprises a material pushing plate horizontally arranged at one side of the bottom die, two partition plates are arranged on the bottom face of the material pushing plate in a spaced manner, and the material pushing plate can move in a reciprocating manner in the direction parallel to the axis of the rectangular through hole and the direction perpendicular to the axis of the rectangular through hole. and the material distributing mechanism is arranged at the tail end of the discharging groove, the material distributing mechanism comprises a feeding plate and photoelectric switches which correspond to the positions of the pins of the semiconductors and are oppositely arranged up and down, a waste groove and a finished product groove are formed in the two sides of the tail end of the discharging groove respectively, the feeding plate comprises a U-shaped groove, and the U-shaped groove is movably arranged among the discharging groove, the waste groove and the finished product groove. The trimming efficiency is high, defective products can be preliminarily screened, and the workload of subsequent procedures is reduced.

Description

technical field [0001] The invention belongs to the field of semiconductor production and processing, in particular to a rib cutting device for semiconductor devices. Background technique [0002] Semiconductors usually use multiple pins to install various chips on the lead frame and then form a package on the lead frame, and then cut the package and a section of pins on the overall frame of the semiconductor device to form a single semiconductor. The pins are shaped at the same time in the process, which is called "cutting ribs". Most of the existing rib cutting devices adopt the step-by-step rib trimming method, that is, put the semiconductor device as a whole into the rib trimming equipment, and then cut off the packages on the semiconductor device one by one, resulting in low efficiency; on the other hand, The lead frame used as a semiconductor carrier will inevitably break or fall off during the early production process and when cutting the ribs. Most of these semicond...

AI Technical Summary

Problems solved by technology

Most of the existing rib cutting devices adopt the step-by-step rib trimming method, that is, put the semiconductor device as a whole into the rib trimming equipment, and then cut off the packages on the semiconductor device one by one, resulting in low efficiency; on the other hand, The lead frame used as a semiconductor carrier will inevitably break or fall off during the early production process and when cutting the ribs. Most of these semiconductors are defective products, and the existing rib cutting device cannot perform preliminary inspection on this part of the semiconductor. Identification, resulting in the mixing of defective products and qualified products, increasing the workload of detection in the subsequent process

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